Aqueous alkali wet method corrosion technology for surface structure of solar cell

A solar cell and surface structure technology, applied in circuits, electrical components, sustainable manufacturing/processing, etc., can solve the problems that the surface state of silicon wafers is difficult to control, the reaction temperature is difficult to determine, etc., to achieve uniform reaction rate and improve work efficiency , the effect of improving work efficiency

Inactive Publication Date: 2009-05-13
展丰能源技术(上海)有限公司
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Problems solved by technology

[0002] The method used before is basically acid corrosion, mainly in HNO 3 The reaction is carried out in a mixed system of / HF. In order to control the reaction rate from being too fast, it is necessary to add NH 3 -H 2 O, so it is easy to produce a large amount of toxic gas and odor during the reaction. The source of the toxic gas is mainly HNO 3 Due to the exothermic reaction during the reaction, it is easily decomposed into NO 2 and N 2 o 4 , the odor mainly comes from NH 3 -H 2 O, at the same time, the reaction temperature is not easy to determine, and the surface state of the silicon wafer is not easy to control

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment one: a kind of NaOH solution wet etching process of solar cell surface structure, concrete steps are:

[0038] Step 1: Thinning, in order to remove the surface damage layer produced by the original silicon wafer after cutting, use

[0039] Use the isotropy of the reaction of the grains of the single crystal silicon wafer in concentrated alkali (the reaction rate of the grains on all sides is the same) for surface pretreatment.

[0040] The relevant process parameters in the thinning process step are:

[0041] The concentration of NaOH solution is 20%-30%; the optimum value is 30%.

[0042] The reaction time is 1-2min; the optimum value is 1.5min.

[0043] The temperature is 70°C-90°C; the optimum value is 80°C.

[0044] Step 2: Texturing. In order to make a surface texture similar to a "pyramid" structure on the surface, the anisotropy of the reaction of the grains of the single crystal silicon wafer in dilute alkali is used (the reaction rate of the grain...

Embodiment 2

[0058] Embodiment 2: An alkali solution wet etching process for the surface structure of a solar cell, in which KOH is used as the alkali solution.

[0059] The operation process of this embodiment two is exactly the same as that of embodiment one, but because KOH alkalinity is much stronger than NaOH, it is easy to cause harm to the human body, so NaOH sodium hydroxide is generally selected as the first-selected chemical material for alkali corrosion.

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Abstract

The invention relates to a solar cell surface processing technology, in particular to an alkaline solution wet etching technique of the surface structure of a solar cell. The technology comprises the following two operation processes of thinning and making herbs into wool. The concrete operation steps of the process of making herbs into wool are as follows: deionized water is added in a water tank of a cleaning device and a heating power supply is turned on; well weighed alkaline solids are poured according to the stipulated solution proportion and stirred evenly; slow release agent isopropyl alcohol is added and stirred evenly after the temperature is increased to the specified temperature; a well thinned silicon wafer is added for reaction. Compared with the existing method, the method can greatly improve the labor production efficiency, reduce the environmental pollution and increase the controllability of production operation.

Description

Technical field: [0001] The invention relates to a treatment process for the surface of a solar cell, in particular to an alkaline solution wet etching process for the surface structure of the solar cell. Background technique: [0002] The method used before is basically acid corrosion, mainly in HNO 3 The reaction is carried out in a mixed system of / HF. In order to control the reaction rate from being too fast, it is necessary to add NH 3 -H 2 O, so it is easy to produce a large amount of toxic gas and odor during the reaction. The source of the toxic gas is mainly HNO 3 Due to the exothermic reaction during the reaction, it is easily decomposed into NO 2 and N 2 o 4 , the odor mainly comes from NH 3 -H 2 O, while the reaction temperature is not easy to determine, and the surface state of the silicon wafer is not easy to control. Invention content: [0003] The object of the present invention is to provide a kind of alkali solution wet etching process of solar ce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18
CPCY02P70/50
Inventor 李文男郭文林
Owner 展丰能源技术(上海)有限公司
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