Method for manufacturing copper clad laminated board adapted to leadless process

A technology of copper-clad laminate and lead-free process, which is applied in the field of PCB board manufacturing, can solve the problems of easy delamination processing performance and cannot meet the processing requirements of high-temperature operating environment, etc., and achieve excellent heat resistance, high toughness, Effect of Low Expansion Coefficient

Active Publication Date: 2009-06-17
ZHEJIANG WAZAM NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing copper clad laminates have the defects of brittleness, easy delamination and poor processability in the lead-free process.
Therefore, the existing copper-clad laminates can no longer m

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0018] Embodiment 1: The manufacturing method of the copper-clad laminate adapted to the lead-free process follows the steps below:

[0019] ①Preparation of brominated epoxy resin, phenolic curing agent, toughening agent, dimethylimidazole, ethyl ethylene dimethyl ether acetate, the above-mentioned components are followed by the weight parts of 125:70:1.5:0.025:14 Stir in a high-speed disperser for 4 hours;

[0020] ②Put the glue prepared in step ① into the glue basin of the vertical gluing machine, then immerse the 7628 glass fiber cloth in the glue, and the 7628 glass fiber cloth is soaked in the glue;

[0021] ③ Arrange the 7628 glass fibers soaked in the glue in step ② in the oven of the vertical gluing machine. The speed of the vertical gluing machine is 10.2m / min, the gelation time is 86S, and the kinematic viscosity of the obtained resin powder is 450P prepreg, the thickness of the prepreg is 0.20mm, and the glass fiber cloth accounts for 60% of the total weight of the...

Example Embodiment

[0024] Embodiment 2: The manufacturing method of the copper-clad laminate adapted to the lead-free process follows the steps below:

[0025] ① Preparation of glue: multifunctional brominated epoxy resin, liquid phenolic curing agent, toughening agent, dimethylimidazole, ethyl ethylene dimethyl ether acetate, the above components are in sequence 125:70:1.5:0.025: 14 parts by weight were filled into the mixer and stirred for 2.5 hours;

[0026] ②Glue application: Put the glue solution prepared in step ① into the glue basin of the glue machine, then immerse the glass fiber cloth in the glue solution, and the glass fiber cloth is soaked in the glue solution;

[0027] ③Make prepreg: Arrange the glass fiber soaked in the glue solution in step ② in the oven of the gluing machine. The speed of the vertical gluing machine is 9.3m / min, the gelation time is 82S, and the kinematic viscosity of the obtained resin powder is 410P prepreg, the thickness of the prepreg is 0.17mm, and the glas...

Example Embodiment

[0031] Embodiment 3: The manufacturing method of the copper-clad laminate adapted to the lead-free process follows the steps below:

[0032] ① Preparation of glue: multi-functional brominated epoxy resin, liquid phenolic curing agent, toughening agent, dimethylimidazole, ethyl ethylene dimethyl ether acetate, the above components are in sequence 125:74:2.5:0.022: 13 parts by weight are filled into a high-speed disperser and stirred for 3 hours;

[0033] ②Glue application: Put the glue solution prepared in step ① into the glue basin of the vertical gluing machine, then soak the glass fiber cloth in the glue solution, and the glass fiber cloth is soaked in the glue solution;

[0034] ③Make prepreg: Arrange the glass fiber soaked in the glue solution in step ② in the oven of the gluing machine. The speed of the vertical gluing machine is 9.8m / min, the gelation time is 94S, and the kinematic viscosity of the obtained resin powder is 560P prepreg, the thickness of the prepreg is 0...

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Abstract

The invention discloses a lead-free copper-clad laminate manufacturing method, which comprises: (1), preparing a glue solution by mixing a brominated epoxy resin, a phenol formaldehyde curing agent, a toughening agent, dimethylimidazole and ethanediyl methoxy methyl ethyl acetate according to weight portion; (2), spreading glue by soaking glass fiber cloth in the glue solution prepared in the step (1) in a glue basin of a glue spreading machine; (3), making a prepregs by placing the glass fiber impregnated with the glue solution in the step (2) in an oven of the glue spreading machine; (4) covering copper foil layers by laminating the prepregs made in the step (3) and covering copper foil layers on the surfaces of the utmost two layers after lamination; and (5) pressing by placing the composite laminate made in the step (4) in a vacuum press for pressing. The copper-clad laminate made by the method has high Tg, toughness and heat resistant and can meet the requirement for lead-free manufacturing. In addition, due to the high toughness, the copper-clad laminate is insusceptible to delamination during punching and V cutting after the lead-free manufacturing of a PCB.

Description

technical field [0001] The invention belongs to the technical field of PCB board manufacturing, in particular to a method for manufacturing a high-Tg, high-toughness copper-clad laminate adapted to a lead-free process. Background technique [0002] As we all know, PCB boards are widely used in electronic products. When electronic products are damaged or scrapped, the PCB boards they carry are also discarded at will. Of course, the existing PCB board will have a certain negative impact on the surrounding environment. In February 2003, the European Union promulgated the "Waste Electrical and Electronic Equipment Directive" (WEEE Directive) and "Regarding the Prohibition of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS Directive). Among them, the RoHS Directive required July 1, 2006 Electrical and electronic products put on the EU market in the future must not contain 6 kinds of harmful substances including lead, mercury, cadmium, hexava...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/06B32B38/08B32B38/16B32B15/14B32B17/04H05K1/02
Inventor 沈宗华游金荣周长松佟德林蒋伟
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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