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Adhesive sheet

A technology of adhesive sheets and adhesives, applied in the direction of adhesive types, ester copolymer adhesives, adhesives, etc., can solve the problems of adhesive contamination, contamination of adherends, etc., and achieve less change over time Effect

Inactive Publication Date: 2009-07-15
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, for example, in the reinforcing sheet for holding a flexible printed circuit board described in the above-mentioned Patent Document 1, vinyl chloride resin containing a large amount of plasticizer is used for the adhesive layer. Disadvantages such as significant pollution
In addition, in the adhesive sheet described in the above-mentioned Patent Document 2, an acrylic resin adhesive containing a phthalate-based plasticizer is used as the adhesive, and there is contamination by the phthalate-based plasticizer. Compounds and other disadvantages

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] To 100 parts by mass (solid content) of an acrylate copolymer prepared by copolymerizing 92.8 mass % of 2-ethylhexyl acrylate, 7.0 mass % of 2-hydroxyethyl acrylate, and 0.2 mass % of acrylic acid, as a crosslinking agent, Aliphatic isocyanate containing hexamethylene diisocyanate [Nippon Polyurethane Industry Co., Ltd., Coronet HX] 9.0 parts by mass (solid content) and acetyl tributyl citrate (ATBC) as a plasticizer [manufactured by Taoka Chemical Industry Co., Ltd.] 2.5 parts by mass (solid content) was stirred sufficiently to prepare a coating binder liquid. This coating solution was coated on one side of a transparent polyethylene terephthalate film [Mitsubishi Chemical Polyester Film Co., Ltd., PET75T-100G] with a thickness of 75 μm using a roll knife coater, and dried. The final thickness was 10 μm, and it was heated and dried at 90° C. for 1 minute. On the adhesive thus formed, one side of the release layer of a polyester release film [Mitsubishi Chemical Polyes...

Embodiment 2

[0047] The operation of Example 1 was repeated except that the amount of acetyl tributyl citrate used as a plasticizer in Example 1 was changed to 37.5 g parts by mass (solid content), thereby preparing an adhesive sheet.

Embodiment 3

[0049] In addition to changing the acrylate copolymer in Example 1 to 68.6% by mass of 2-ethylhexyl acrylate, 30.0% by mass of methyl acrylate, 0.2% by mass of glycidyl methacrylate, and 1.2% by mass of acrylic acid. Acrylic ester copolymer, change the consumption of the acetyl tributyl citrate as plasticizer into 12.5 parts by mass (solid content), repeat the operation of embodiment 1, make adhesive sheet thus.

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Abstract

An adhesive sheet comprising a substrate and an adhesive layer formed on at least one side of the substrate, characterized in that an adhesive agent contained in the adhesive layer comprises an acrylic ester copolymer and a citrate plasticizer; the acrylic ester copolymer has a glass transition temperature of -45 DEG C or less; the citrate plasticizer is contained in an amount of 1.0 to 50.0 parts by mass (solid content), with respect to 100 parts by mass (solid content) of the acrylic ester copolymer; and a rate of a gel content in the adhesive agent in the adhesive layer is 70% or more, is disclosed. The adhesive sheet according to the present invention has a slightly-adhesive property and a removable property, and can be suitably used, for example, as a carrier sheet.

Description

technical field [0001] The present invention relates to an adhesive sheet. The adhesive sheet of the present invention can be used as an engineering sheet in the processing technology of flexible printed substrates (FPC) due to its moderate adhesive performance and excellent re-peelability, or in reflective films and diffuser films for optical applications. Advantageously used as an engineered sheet in the peeling process. Background technique [0002] With the thinning and miniaturization of flexible printed circuit boards (FPCs) in recent years, the thinning of films such as copper clad laminates (CCL) and polyimide films used in them is also progressing. Therefore, the rigidity of these films itself decreases, and processing at the time of manufacturing FPC becomes difficult. Therefore, the widely adopted scheme is to ensure the rigidity of the whole by pasting these FPC films on the engineering sheet before processing, so that the operation during processing is simple ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B32B7/10B32B27/22B32B27/30C09J11/06C09J133/08C09J175/04
CPCC09J133/08C08K5/11H05K1/0393C08G18/6254C09J175/04C09J7/0217C09J2205/102H05K3/007C08K5/0016H05K2203/0156C09J2467/006H05K3/386C09J11/06C08L2312/00C08L2666/28C09J7/385C09J2301/408Y10T428/2891
Inventor 卫藤广行铁本卓也
Owner LINTEC CORP
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