Adhesive sheet
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LINTEC CORP
- Publication Date
- 2009-07-15
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The present invention relates to an adhesive sheet. The adhesive sheet of the present invention can be used as an engineering sheet in the processing technology of flexible printed substrates (FPC) due to its moderate adhesive performance and excellent re-peelability, or in reflective films and diffuser films for optical applications. Advantageously used as an engineered sheet in the peeling process. Background technique
[0002] With the thinning and miniaturization of flexible printed circuit boards (FPCs) in recent years, the thinning of films such as copper clad laminates (CCL) and polyimide films used in them is also progressing. Therefore, the rigidity of these films itself decreases, and processing at the time of manufacturing FPC becomes difficult. Therefore, the widely adopted scheme is to ensure the rigidity of the whole by pasting these FPC films on the engineering sheet before processing, so that the operation during processing is simple ...