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Ink composition, package structure and semiconductor device

A composition and ink technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of low curing shrinkage rate and inability to take into account high light curing rate

Pending Publication Date: 2020-04-10
ZHEJIANG FORST NEW MATERIAL RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The main purpose of the present invention is to provide a kind of ink composition, encapsulation structure and semiconductor device, to solve the film encapsulation material in the prior art can not take into account the problem of high photocuring rate, low curing shrinkage rate

Method used

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  • Ink composition, package structure and semiconductor device
  • Ink composition, package structure and semiconductor device
  • Ink composition, package structure and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] In a 1000 mL flask with cooling tube and stirrer, put 500 mL of toluene, 54.11 g of 1,1,3,5,5-pentamethyl-3-phenyltrisiloxane and 74.51 g of 4-vinyl -1-cyclohexene-1,2-epoxy, followed by nitrogen purging for 60 min. After that, 0.0063 g of platinum(0)-1,3-diethylene-1,1,3,3-tetramethyldisiloxane was put into the flask, and the temperature of the flask was increased to 40° C., followed by Stir for 4h. The residual solvent was removed by distillation, thereby preparing a compound represented by formula 1, which is designated as I. 97% purity as determined by HPLC. m / e:588.24; 1 H NMR (400MHz, Chloroform-d) δ7.51(m, 1H), δ7.28(m, 2H), δ7.18(m, 2H), δ1.45(m, 4H), δ1.60(dd ,2H),δ2.87(dd,2H),δ1.60-1.70(dd,4H),δ1.43(m,2H),δ1.3(m,4H),δ0.21(m,12H) , δ0.66(s, 3H), δ0.8(m, 4H).

[0068] [Formula 1]

[0069]

Embodiment 2

[0071] In a 1000 mL flask with cooling tube and stirrer, put 800 mL of toluene, 33.26 g of 1,1,5,5-tetramethyl-3,3-diphenyltrisiloxane and 91.3 g of allyl glycidol ether, followed by a nitrogen purge for 60 min. After that, 0.0063 g of platinum(0)-1,3-diethylene-1,1,3,3-tetramethyldisiloxane was put into the flask, and the temperature of the flask was increased to 70° C., followed by stirring 4h. Residual solvent was removed by distillation. Thus, a compound represented by formula 2 was prepared and designated as II. HPLC assay has a purity of 97%, m / e: 560.24; 1 H NMR (400MHz, Chloroform-d)δ7.53(m,2H),δ7.29(m,4H),δ7.19(m,4H),δ3.63(d,4H),δ3.38(m ,4H),δ2.86(dd,2H),δ2.38(dd,4H),δ1.5(m,4H),δ1.02(m,4H),δ0.21(s,12H).

[0072] [Formula 2]

[0073]

Embodiment 3

[0075] In a 1000mL flask with a cooling tube and a stirrer, put 800mL of toluene, 30g of 1,1,5,5-tetramethyl-3-diphenyltrisiloxane and 50g of allyl alcohol, followed by nitrogen purging for 60min . After that, 0.003 g of platinum(0)-1,3-diethylene-1,1,3,3-tetramethyldisiloxane was put into the flask, and the temperature of the flask was increased to 70° C., followed by stirring 4g. Residual solvent was removed by distillation to obtain a crude product of an intermediate terminal with a hydroxyl group on one side. The crude product was separated by column chromatography of ethyl acetate and petroleum ether to obtain an intermediate product with a purity of 98% liquid chromatography. The above-mentioned intermediate was added to a three-necked flask containing 300 mL of anhydrous dichloromethane, and 21 g of triethylamine was added. Next, 45 g of acryloyl chloride were introduced slowly while stirring at 0°C. The residual solvent is removed by distillation, thereby preparing ...

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Abstract

The invention provides an ink composition, a package structure and a semiconductor device. The ink composition comprises a photocurable silicon-containing monomer component, an active diluent component and a photoinitiator component, wherein the photocurable silicon-containing monomer component is a photocurable silicon-containing monomer or a combination of a plurality of photocurable silicon-containing monomers; each photocurable silicon-containing monomer has a structural formula as shown in the specification; and in the structural formula, at least one of A1 and A2 is an acrylate group, and at least one of A1 and A2 is an epoxy group. Monomers containing two functional groups, i.e., acrylate and epoxy, are mixed for use, so a free radical-cation hybrid curing system can be formed; andthe material integrating the advantages of the acrylate and epoxy photocurable silicon-containing monomers is obtained, and an organic barrier layer with a high photocuring rate, a low curing shrinkage rate and moderate base material adhesive force and hardness is achieved. Therefore, requirements on a packaging film in the prior art are better met.

Description

technical field [0001] The invention relates to the technical field of packaging materials, in particular to an ink composition, a packaging structure and a semiconductor device. Background technique [0002] Organic Light-Emitting Diodes (OLEDs) have the characteristics of all solid state, active light emission, high brightness, high contrast, ultra-thin and ultra-light, low cost, low power consumption, no viewing angle limitation, wide operating temperature range, etc. , and can be made on a flexible, light, and durable plastic substrate, which can realize a truly flexible display, and is a technology that best meets people's requirements for future displays. [0003] Various types of light-emitting diodes currently used are mainly composed of organic small molecule light-emitting diodes (OLEDs), polymer organic light-emitting diodes (POLEDs), organic phosphorescent light-emitting diodes (PHOLEDs) and organic thermally activated delayed emission materials (TADF). However,...

Claims

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Application Information

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IPC IPC(8): C09D11/36H01L23/29
CPCC09D11/36H01L23/296
Inventor 洪海兵王士昊
Owner ZHEJIANG FORST NEW MATERIAL RES INST CO LTD
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