Metal gas supply apparatus and remaining gas removal apparatus used for thin film depositing apparatus and method thereof

Abstract

Disclosed is a thin film deposition apparatus, and particularly, a metal gas supply apparatus for supplying a metal material for forming a thin film and a residual gas removal apparatus for removing residual gas after the thin film deposition, which are provided in the thin film deposition apparatus. The metal gas supply apparatus of the thin film deposition apparatus includes a carrier gas supplyunit for supplying a carrier gas such that a metal material is transferred into a thin film deposition chamber spaced apart by a predetermined interval from a target on which a thin film is to be deposited; a metal gas generator unit for storing and subliming the metal material such that the metal material is mixed with the carrier gas; a carrier gas injection line, which connects the carrier gassupply unit and the metal gas generator unit, transfers the carrier gas and the metal gas into the chamber, and is provided with a heater for maintaining the carrier gas or the metal gas at a sublimation temperature of the metal material or higher.

Description

technical field [0001] The invention relates to a thin film deposition device, in particular to a metal material raw material gas supply device for forming a thin film for the thin film deposition device, and a residual gas treatment device for treating residual gas after film deposition. Background technique [0002] A thin film refers to a thin film with a thickness of several microns or less that cannot be realized by mechanical processing. This includes the oil film on the water surface, the film condensed by soap droplets, the rust on the metal surface, the iron sheet, the lead film of pig iron, the tin film, etc. In addition, there are some films (such as metal films, semiconductor films, insulating films, compound Semiconductor thin films, magnetic thin films, dielectric thin films, integrated circuit thin films, superconductive thin films, etc.) are formed by electroplating, gas or liquid oxidation, compound heat, etc. Decomposition method, electron beam deposition ...

AI Technical Summary

Problems solved by technology

[0013] Conventional raw material supply devices only provide the function of supplying metal materials to the chamber, so there are some problems for effective thin film deposition

[0014] In addition, raw material gas is supplied to the chamber even when the thin film deposition process is not performed, resulting in waste of raw material gas

[0015] In addition, conventional raw material gas supply devices have the following problems: when only the transport gas supplying the metal material is injected and the film deposition process is performed in the chamber, the film is deposited on the optical window for transmitting the laser beam into the chamber, or The problem of raw material gas leakage

[0016] Moreover, the conventional exhaust device has the following problems: all the exhausted residual gas is discharged into the atmosphere to cause air pollution, and the metal material with the residual gas memory cannot be reused.

In particular, there is the following problem: Even if the metal material is a high-priced metal such as gold, it cannot be reused. If the temperature of the exhaust pipe cannot be maintained at a temperature above the sublimation point of the raw material supply device, the raw material gas will stick to the exhaust pipe again and block. living pipe

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