Method for plating parylene film on surface of LED chip

A technology of LED chips and dimethylbenzene, which is applied in the field of polymer vacuum coating, can solve problems such as product failure and impact on service life, and achieve the effects of convenient operation, improved reliability, and strong adhesion

Inactive Publication Date: 2009-12-16
黄益新
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, at present, many LED lighting products fail due to moisture or water penetration. Oxidation and corrosion have always plagued the further promotion and application of LED lighting products, especial

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  • Method for plating parylene film on surface of LED chip

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Embodiment Construction

[0014] The present invention will be further described in detail through the following embodiment in which the plated part is an LED chip, and the plated part can also be a lithium-iron battery or a solar photovoltaic electric panel.

[0015] See attached figure 1 , the coating device of the present invention comprises: vaporization chamber 1, cracking chamber 2, deposition chamber 3, cold trap chamber 4, concrete plating steps are as follows:

[0016] a. Cleaning

[0017] (i) Ultrasonic cleaning of the LED chip with absolute ethanol for 6 minutes, and then vacuum drying for 8 minutes, the temperature of the drying oven is 90° C., and the pressure is 100 Pa.

[0018] (ii), the above-mentioned ultrasonically cleaned LED chips are placed in the aqueous solution of silane coupling agent alcohol and soaked for 1 minute, then rinsed twice with ethanol aqueous solution, put into a vacuum drying oven after drying for 8 minutes, and the drying oven temperature is 90°C, pressure 100P...

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Abstract

The invention discloses a method for plating a parylene film on a surface of a LED chip. The method is characterized by comprising the following steps that a plating part LED chip is placed into a settling chamber; a film plating material parylene is placed into an evaporation chamber; the film plating material enters the settling chamber as activated monomers after vaporizing and cracking; a uniform and transparent parylene film is settled on the surface of the LED chip, wherein, the film plating device comprises a vaporization chamber, a cracking chamber, the settling chamber and a cold trap chamber. The method has simple process, convenient operation, strong film adhesive force and uniform film thickness, greatly improves the reliability, safety and service life of the product, solves the problems of water resistance, humidity resistance, high temperature resistance and acid-base corrosion of LED lighting products, and contributes to further popularization and application of LED brightening and electricity saving engineering.

Description

technical field [0001] The invention relates to the technical field of polymer vacuum film coating, in particular to a method for coating a parylene film on the surface of an LED chip. Background technique [0002] Existing LED lighting products mainly use shell packaging to solve their dustproof, waterproof, and moisture-proof problems, so as to protect the LED lighting products from oxidation and corrosion. However, at present, many LED lighting products fail due to moisture or water penetration. Oxidation and corrosion have always plagued the further promotion and application of LED lighting products, especially for long-term use in underwater or warm and humid working environments. The maintenance and heat dissipation problems of the entire LED lighting project are more prominent, which affects the service life. Therefore, solving the dust-proof, waterproof, moisture-proof and efficient heat dissipation problems of LED lighting products is the key to the success of LED ...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/12
Inventor 黄益新
Owner 黄益新
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