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Nano-copper conductive ink preparation method

A conductive ink and nano-copper technology, applied in the field of nano-materials, can solve the problems of difficult dispersion of conductive media, difficulty in achieving conductivity, and high heating temperature, and achieve the effects of good conductivity, short reaction time, and low preparation cost

Inactive Publication Date: 2009-12-23
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the invention has a high heating temperature, and the general technical standard that the nano-copper content of the final product is lower than 40%, so it is difficult to achieve good conductivity
Patent 01138495.6 discloses a conductive ink composition, which uses an epoxy thermal curing system and is prepared with silver, copper, or silver-clad copper as the conductive medium. Since the conductive medium is difficult to disperse uniformly, there is also a hidden danger of poor conductivity.

Method used

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  • Nano-copper conductive ink preparation method
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Example 1: Dissolve 0.01mol of copper sulfate pentahydrate in 100ml of ethanol, add 5ml of oleic acid and 0.5g of polyvinylpyrrolidone (K30), stir to dissolve, and heat up to 50°C. Slowly add 10ml of hydrazine hydrate solution, stir vigorously, the solution gradually turns deep red, indicating the generation of nano-copper, and stop heating after 20 minutes.

Embodiment 2

[0026] Example 2: The cooled solution was left to stand, and the electrodialysis was maintained for 20 hours with a voltage of 4-8V, which can effectively remove impurities. See Table 1 for the effect of removing impurities.

Embodiment 3

[0027] Embodiment 3: The nano-copper conductive ink prepared in Example 2 was subjected to vacuum distillation, and the concentration of the final nano-copper was controlled to be about 40wt% according to the amount of fractions.

[0028] The impurity element content analysis result of table 1 nanometer copper ink

[0029] the element

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Abstract

The invention belongs to the nanometer material technical field, in particular to a nano-copper conductive ink preparation method, comprising the following steps: dissolving copper salt and organic protective agents in a solvent, heating the solution to 30-100 DEG C, simultaneously adding reducing agent in the reaction system to react while stirring for 20-30min, then cooling gradually; finally obtaining stable nano-copper conductive ink through electrodialysis separation and reduced pressure distillation. The invention has simple process, mild reaction conditions and short reaction time; the conductibility of the product is good, the particle size of nano-copper is 20-70nm, the nano-copper can not be oxidized for one month in the air; the production cost is low and no hazardous waste can be generated, thus meeting the demand of 'green production'.

Description

technical field [0001] The invention belongs to the technical field of nanometer materials, and in particular relates to a preparation method of a nano-copper conductive ink, in particular to a preparation method of a novel nano-copper conductive ink with good preparation stability and excellent conductivity. Background technique [0002] Since the 1980s, a nanotechnology that has attracted worldwide attention has developed rapidly. Nanotechnology will cause revolutionary changes in many industrial fields in the 21st century. Nanotechnology shows wide application potential in materials, information, energy, environment, life, military, manufacturing, etc. It is the source of high-tech development in the 21st century and will bring huge changes to human life. Key strategic areas of technology and the commanding heights of the global economy. [0003] Nano-copper has superplastic ductility and can be stretched more than 50 times at room temperature without cracks. The mecha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/02H01B1/22H05K1/09C09D11/52
Inventor 杨振国唐晓峰王卫江
Owner FUDAN UNIV
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