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Plating method for preventing hydrogen bubbles of copper-tin alloy plating layer

A technology of copper-tin alloy and coating, which is applied in the field of pulse electroplating technology to prevent hydrogen bubbling of copper-tin alloy coating, can solve the problems of affecting material performance, reducing material toughness, and no one has raised it, achieving strong applicability, low cost, The effect of easy operation

Inactive Publication Date: 2010-02-17
HARBIN ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But no one has come up with an effective way to prevent hydrogen bubbling in the coating
Hydrogen bubbling will seriously affect the performance of the material, reducing the toughness and strength of the material, causing the material to fracture at a condition much lower than the yield strength

Method used

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  • Plating method for preventing hydrogen bubbles of copper-tin alloy plating layer
  • Plating method for preventing hydrogen bubbles of copper-tin alloy plating layer

Examples

Experimental program
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Effect test

Embodiment 1

[0026] 1. Preparation of copper-tin alloy coating by pulse electroplating technology

[0027] Electrolytic deposition equipment: pulsed electrolytic deposition equipment

[0028] Requirements for the electrolyte used in electrolytic deposition: the copper-tin alloy electroplating solution is the main salt is potassium pyrophosphate (K 4 P 2 o 7 ) 240-280g / L, copper pyrophosphate (Cu 2 P 2 o 7 ·3H 2 O)34-47g / L and stannous pyrophosphate (Sn 2 P 2 o 7 ) 2.6-4.3g / L pyrophosphate low-tin bronze electrolyte, pH 8-9; strictly control the content of heavy metal impurities in the electrolyte, the water used for distributing the electrolyte is high-purity deionized water, and the pH of the electrolyte is 8~9.

[0029] Cathode and anode material requirements: the anode is a high-purity 99.99% pure copper plate, and the cathode is a 27SiMn steel plate after degreasing treatment.

[0030] 2. Electrolytic process parameters: square wave pulse electroplating. Pulse average curre...

Embodiment 2

[0035] 1. Preparation of copper-tin alloy coating by pulse electroplating technology

[0036] Electrolytic deposition equipment: pulsed electrolytic deposition equipment

[0037] Requirements for the electrolyte used in electrolytic deposition: the copper-tin alloy electroplating solution is the main salt is potassium pyrophosphate (K 4 P 2 o 7 ) 240-280g / L, copper pyrophosphate (Cu 2 P 2 o 7 ·3H 2O)34-47g / L and stannous pyrophosphate (Sn 2 P 2 o 7 ) 2.6-4.3g / L pyrophosphate low-tin bronze electrolyte, pH 8-9; strictly control the content of heavy metal impurities in the electrolyte, the water used for distributing the electrolyte is high-purity deionized water, and the pH of the electrolyte is 8~9.

[0038] Cathode and anode material requirements: the anode is a high-purity 99.99% pure copper plate, and the cathode is a 27SiMn steel plate after degreasing treatment.

[0039] 2. Electrolytic process parameters: square wave pulse electroplating. Pulse average curren...

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Abstract

The invention provides a plating method for preventing hydrogen bubbles of a copper-tin alloy plating layer. A plating anode material is a high-purity copper plate with purity of 99.9 percent, a cathode material is a 27 SiMn steel plate which is processed by oil-removing treatment, copper-tin alloy plating liquid is industrial low-tin bronze electrolyte, and pH is 8-9. The plating method comprisesplating parameters: the plating adopts a square-wave impulse plating technology, the impulse average current density is 1-5 A / dm<2>, the frequency is 500Hz-2500Hz, the duty ratio is 25-40 percent, aspace between a cathode and an anode is 5-10cm, the area ratio of the cathode to the anode is from 1:1.5 to 1:5, and the electrolyte temperature is from 25 DEG C to 35 DEG C. Compared with the traditional DC plating copper-tin alloy technology, the plating method introduces impulse current and effectively inhibits hydrogen generation in a planting process, and optimal technological parameters of the impulse plating technology are sieved, thereby the hydrogen bubbles of the copper-tin alloy plating layer can be prevented. The plating method for preventing hydrogen bubbles of a copper-tin alloyplating layer has simple technology, low cost, strong applicability, and the like.

Description

(1) Technical field [0001] The invention relates to an electroplating technology, in particular to a pulse electroplating technology for preventing hydrogen bubbling of a copper-tin alloy coating. (2) Background technology [0002] Electroplating copper-tin alloy is one of the most widely used alloy coatings. Electroplated copper-tin alloy has the advantages of flatness, good brightness, low cost, more realistic color, good decorative effect, good smoothness, corrosion resistance and suitable hardness; it can prevent the diffusion of the underlying metal to the surface layer, prevent Discoloration of metal plating and other advantages. [0003] However, a large amount of hydrogen bubbling often occurs on the surface of the copper-tin alloy coating, which seriously affects the quality of the coating. This is because the dilute hydrochloric acid solution not only reacts with the oxide skin on the surface of the workpiece during the pickling process to achieve the purpose of ...

Claims

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Application Information

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IPC IPC(8): C25D3/58C25D5/18
Inventor 孟国哲孙飞龙王世杰邵亚薇张涛王福会
Owner HARBIN ENG UNIV
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