Large size conductive substrate thick circuit write-through device and write-through technology thereof

Abstract

The invention discloses a large size conductive substrate thick circuit write-through device and write-through technology thereof. The device comprises a controller, a platform, a conductive substrateto be written through, a laser transmitter and a polarizer unit arranged on the laser path; wherein the platform is static, and more than one polarizer unit are arranged, so as to form a multi-polarizer array above the platform. The controller drives the multi-polarizer array to control the focus of the laser path to move at certain speed along etching direction, the multi-polarizer array with relatively fixed mechanical structure is utilized to realize circuit detail drawing write-through on the full size of a conductive substrate, thus providing a feasible technology approach for rapidly and accurately write-through preparation of thick circuit with wire width more than 30 microns on a large size conductive substrate. The invention has the special effects of low wiring cost, minimum wire width and minimum wire distance as short as 30 microns, large processing size, fast processing speed and high location and repeated write-through performance.

Description

technical field [0001] The invention relates to a direct writing device and process for preparing micro-thick and thin conductive lines on a conductive substrate, in particular to a device and a process capable of rapid processing, high-precision positioning, and repeated direct writing on a large-format conductive substrate. Background technique [0002] At present, laser direct writing systems with different structures are used in many industries such as integrated circuit manufacturing, micro-optical component processing, MEMS, optical detection, and optical anti-counterfeiting. Therefore, the development of laser direct writing system has attracted much attention. The existing relatively mature wiring technology includes: screen printing, single-galvanometer platform stepping laser direct writing, platform moving laser direct writing and mask lithography, etc. Specifically: [0003] Screen printing: After the screen screen is covered with photosensitive glue, it is expo...

AI Technical Summary

Problems solved by technology

[0007] However, these existing direct writing processes have more or less defects, such as high cost of plate making and ink in the wiring process of screen printing, and poor positioning and repeated direct writing accuracy, and the yield rate of lines less than 100 μm Very low; the wiring process of mask lithography is expensive for mask making, exposure and etching, and direct writing is not cost-effective for large-format situations; the processing format of platform-moving laser direct writing is determined by the stroke of the X and Y servo motors , and the processing speed is particularly slow when it is a non-X or Y-direction line such as an arc or a broken line; while the processing speed of the single-galvanometer + platform stepping laser direct writing process is slow; the single-format precision is high, but when combined with the step The precision of the advanced large-format direct writing process is poor

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