Magnesium alloy direct chemical plating NI-P-SiC plating solution formula and plating process
An electroless plating, magnesium alloy technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve the difficulty of preparing magnesium alloy electroless nickel plating solution, the corrosion resistance of magnesium alloy electroless nickel plating The problems of poor wear resistance and high cost can achieve the effect of simplifying the bath preparation process, good combination and stable bath
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Embodiment 1
[0034] A plating process and method for electroless Ni-P-SiC plating on a magnesium alloy, comprising the steps of:
[0035] 1. Prepare the electroless Ni-P plating solution, and weigh the medicine according to the above formula 1: first dissolve the above medicine with a small amount of distilled water, then dilute the mixed water to 1L, and adjust the pH value to 4.8 with concentrated ammonia water.
[0036] 2. Pretreatment of SiC particles: Before composite plating, SiC powder is dipped in 1:1 hydrochloric acid solution for 24 hours to remove impurities, then finely neutralized with distilled water, dehydrated with ethanol, and dried for later use.
[0037] 3. Prepare SiC dispersion liquid and composite plating liquid: weigh the medicine according to the above formula and mix them as the dispersion liquid. Mix 2 g of the treated SiC particles with a small amount of distilled water and the above-mentioned surfactant, first ultrasonically disperse for 30 minutes, then add a s...
Embodiment 2
[0042] A kind of electroless Ni-P-SiC plating process and method for magnesium alloy, concrete steps are as follows:
[0043] 1. Prepare the electroless Ni-P plating solution, and weigh the medicine according to the above formula 2: first dissolve the above medicine with a small amount of distilled water, then mix and dilute to 1L, and adjust the pH value to 5.2 with concentrated ammonia water.
[0044] 2. Pretreatment of SiC particles: Before composite plating, SiC powder is dipped in 1:1 hydrochloric acid solution for 24 hours to remove impurities, then finely neutralized with distilled water, dehydrated with ethanol, and dried for later use.
[0045] 3. Preparation of SiC dispersion liquid and composite plating liquid: Weigh 40 mg of sodium dodecylbenzene sulfonate and 20 mg of polyethylene glycol as dispersion liquid, mix 6 g of treated SiC particles with a small amount of distilled water and surfactant, and ultrasonically Disperse for 30 minutes, then add a small amount o...
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