Cell electrofusion chip device based on micro-chamber array structure
An array structure and array chip technology, which is applied in the field of providing cell electrofusion chips and biological cell electrofusion devices, can solve the problems of large chip spacing, increased system cost, and difficult precise control of cells, so as to reduce requirements and queue up The effect of high rate and high pairwise fusion rate
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Embodiment 1
[0046] see figure 1 , figure 2 , The cell electrofusion microelectrode array chip device based on the micro-chamber structure is composed of a micro-chamber array chip 1 , a flow path control module 2 and a peripheral printed circuit board 3 .
[0047] see figure 2 , image 3 and Figure 4 , the micro-chamber array chip 1 has a quartz base layer 8 , and a metal micro-electrode array 4 , a polymer side wall 7 and a polymer water fence 6 are formed on the quartz base layer 8 by micromachining technology. The metal microelectrode array 4 integrates a large number of metal microelectrodes 5, and two opposite metal microelectrodes 5 and two opposite polymer side walls 7 form a micro chamber 9, and the micro chambers 9 are also arranged in an array. The metal micro-electrode array 4 can be made of gold, platinum and other materials, and the polymer material can be selected from polyimide, parylene and other materials; the depth of the micro chamber 9 is 15 μm, the width is 5-3...
Embodiment 2
[0051] Embodiment 2: Processing technology of part of the structure in the above-mentioned device
[0052] 1. The micro-chamber array chip is realized by MEMS processing technology. The processing steps are as follows (the metal array electrode layer material described here is gold Au, and the polymer layer material is polyimide):
[0053] A. Select quartz as the substrate for processing chips;
[0054] B. Sputter a layer of Ti / W on the quartz substrate, wherein the thickness of the Ti / W layer is 50nm;
[0055] C. Electroplating a layer of gold on the surface of the Ti / W layer by electroplating with a thickness of 15 μm;
[0056] D. The shape of the micro-electrode array is etched on the Ti / W / Au layer by photolithography;
[0057] E. Spin-coat polyimide glue on the surface of the above structure to form a polyimide layer with a thickness equivalent to the thickness of the Ti / W / Au layer (15μm);
[0058] F. Photolithography of polyimide to form sidewall structures of tiny cha...
Embodiment 3
[0065] Example 3: Application of Cell Electrofusion
[0066] From the injection port 14 described in Example 1, the cell suspension is injected using a micropump; when the cell suspension enters the storage tank 12 through the passage formed by the conduit 10, the injection port 14 and the microchannel 13, the cells will Under the action of gravity, it will sink into the lower micro chamber 9 corresponding to the sample storage tank 12; the special structure of the micro chamber 9 can only accommodate 2 cells in a single layer, and the excess cells will accumulate on it; at this time, combined with the flow path control device 2. Use a micro pump to inject the cell electrofusion buffer; because the micro chamber 9 is a micro pit structure, under the blocking of the polymer side wall 7, the two cells in the micro chamber 9 will not be flushed out by the micro flow; and The excess cells stacked on it will flow out along the microchannel 13, the sample outlet 15 and the conduit 1...
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