Epoxy resin composition, preparation method thereof, laminated material and copper-clad laminated board manufactured by adopting epoxy resin composition

一种环氧树脂、组合物的技术，应用在电路基板材料、化学仪器和方法、织物等方向，能够解决Df高、高频线路板信号传速不利等问题，达到良好耐热性、有利于信号传输、制备过程简单方便的效果

Active Publication Date: 2010-06-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the Df of the cured resin prepared by the above method is generally high, which is not good for the signal transmission speed of the high-frequency circuit board.

Method used

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  • Epoxy resin composition, preparation method thereof, laminated material and copper-clad laminated board manufactured by adopting epoxy resin composition
  • Epoxy resin composition, preparation method thereof, laminated material and copper-clad laminated board manufactured by adopting epoxy resin composition
  • Epoxy resin composition, preparation method thereof, laminated material and copper-clad laminated board manufactured by adopting epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] A novolac resin with a softening point of 45±2°C and a degree of polymerization of 1.5 was used as a chain scission agent to prepare a polyphenylene ether resin with a new structure. 1000 parts of polyphenylene ether resin (SUBIC company, number average molecular weight is 16000), 120 parts of novolac resin (KOLON, brand KPE-2100) and heated to dissolve, add 35 parts of benzoyl peroxide, and stir while heating Redistribution reaction; the reaction temperature is 95°C, and the time is 2h. The number average molecular weight of the reaction product was measured to be 4540 by gel permeation chromatography (Waters GPC2000).

[0059] Use 100 parts of polyphenylene ether resin prepared above (calculated according to the weight of the composition), add 150 parts of epoxy resin, then add epoxy resin curing agent, accelerator and other auxiliary agents, stir at room temperature or under heating for 30-120min , to obtain the above-mentioned epoxy resin composition.

Embodiment 2

[0061] A novolac resin with a softening point of 45±2°C and a degree of polymerization of 1.5 was used as a chain scission agent to prepare a polyphenylene ether resin with a new structure. 1000 parts of polyphenylene ether resin (SUBIC company, number average molecular weight is 16000), 160 parts of novolac resin (KOLON, brand KPE-2100) and heated to dissolve, add 25 parts of benzoyl peroxide, and stir while heating Redistribution reaction; the reaction temperature is 95°C, and the time is 2h. The number average molecular weight of the reaction product was measured to be 4080 by gel permeation chromatography (Waters GPC2000).

[0062] Use 100 parts of polyphenylene ether resin prepared above (calculated according to the weight of the composition), add 150 parts of epoxy resin, then add epoxy resin curing agent, accelerator and other auxiliary agents, stir at room temperature or under heating for 30-120min , to obtain the above-mentioned epoxy resin composition.

Embodiment 3

[0064] A novolac resin with a softening point of 65±2°C and a degree of polymerization of 2 was used as a chain scission agent to prepare a polyphenylene ether resin with a new structure. After 2400 parts of polyphenylene ether resin (SUBIC company, number average molecular weight is 16000), 360 parts of novolac resin (KOLON, brand KPE-2000) and heating and dissolving, add 20 parts of benzoyl peroxide and stir while heating Redistribution reaction; the reaction temperature is 95°C, and the time is 2h. The number average molecular weight of the reaction product was measured to be 4842 by gel permeation chromatography (Waters GPC2000).

[0065] Use 100 parts of polyphenylene ether resin prepared above (calculated according to the weight of the composition), add 150 parts of epoxy resin, then add epoxy resin curing agent, accelerator and other auxiliary agents, stir at room temperature or under heating for 30-120min , to obtain the above-mentioned epoxy resin composition.

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Abstract

The invention relates to an epoxy resin composition, a preparation method thereof, a laminated material and a copper-clad laminated board manufactured by adopting the epoxy resin composition. The epoxy resin composition comprises the following components in part by mass: 30 to 80 parts of epoxy resin, 20 to 50 parts of polyphenyl ether resin with a novel structure, 0 to 50 parts of filler and 1 to 20 parts of assistant, wherein the polyphenyl ether resin is obtained through redistribution reaction of polyphenyl ether and phenolic resin in the presence of a reaction initiator, and the number-average molecular weight of the polyphenyl ether resin is 1,000 to 5,000. The epoxy resin composition provided by the invention not only has good heat resistance and dielectric property, but also has simple and convenient preparation process and is favorable for industrialized large-scale production; and in addition, the laminated material and the copper-clad laminated board manufactured by using the epoxy resin composition are applied to a printed circuit board, have good heat resistance, dielectric property and machining property, and are favorable for signal transmission of a high-frequency circuit board.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition and a preparation method thereof, and a laminated material and a copper-clad laminate made of the epoxy resin composition. Background technique [0002] At present, brominated epoxy resin and dicyandiamide curing system, or multifunctional epoxy resin and phenolic aldehyde curing agent system are usually used as substrates for printed circuit boards. The former has good adhesion and machinability , but the heat resistance is slightly poor; so with the advent of the lead-free era, higher requirements are put forward for the heat resistance of copper clad laminates. In IPC-4101B, clear requirements are put forward for the four major indicators of the plate, such as glass transition temperature (Tg), thermal decomposition temperature (Td), thermal delamination time (T-XXX) and Z-axis thermal expansion coefficient (CTE). Therefore, the multifunctional epoxy re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08L71/12C08L61/14C08K13/02C08K3/36C08K3/34C08K3/26C08G81/00B32B17/10B32B15/092B32B15/098B32B15/20H05K1/05
CPCC08G65/485C08K5/0008C08L71/126C08K3/0033C08L63/00C08K7/04C08K3/013Y10T428/2915Y10T428/2971Y10T428/24994Y10T428/31525Y10T428/31529Y10T442/20C08L71/12
Inventor 魏东方克洪
Owner GUANGDONG SHENGYI SCI TECH
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