Resin composition and method for preparing FPC coverlay by using same

A technology of resin composition and cover film, which is applied in printed circuit parts, non-metallic protective layer coating, secondary treatment of printed circuit, etc., can solve the problem of insufficient folding resistance, long-term flexing resistance and weather resistance, Restricting the popularization and application of LED light strips, reducing the qualified rate of products and other issues, achieving the effects of good weather resistance, high flexibility and adhesion, and improving production efficiency

Inactive Publication Date: 2010-06-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the traditional process of LED light strips is to apply a layer of white or black ink on the surface after pressing the FPC cover film to improve the contrast of the LED light strip and enhance its contrast effect. This method not only increases the process, but also consumes Working time, and because it has great deficiencies in many properties such as folding resistance, long-term flexing resistance and weather resistance, in addition, this traditional process reduces the qualified rate of products and increases product costs. Therefore, Based on the above many deficiencies, to a certain extent, it also limits the popularization and application of LED light strips.

Method used

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  • Resin composition and method for preparing FPC coverlay by using same
  • Resin composition and method for preparing FPC coverlay by using same
  • Resin composition and method for preparing FPC coverlay by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Weigh flexible amorphous linear saturated polyester (product model Vitel3300B, manufactured by Bostik Company), 65 parts by weight; hard amorphous linear saturated polyester (product model Vitel2200B, manufactured by Bostik Company), 35 parts by weight; blocked isocyanate Curing agent (commodity model 1530, manufactured by Bostik Company), 5 parts by weight; Rutile type titanium dioxide (commercial model TRONOX CR828, product of Kemeiji Co., Ltd., Australia), 110 parts by weight; Defoamer (commodity model BYK-57, BYK Company product), 0.5 parts by weight, adjust the solid content of the glue solution to 48% with a methyl ethyl ketone solvent, and mix it into a white resin composition.

[0044] The white resin composition is coated on a polyimide insulating base film with a thickness of 12.5 μm by a coating machine, and the thickness of the coating is 13 μm, and then baked in an oven at 160° C. for 5 minutes to form a solid surface on the polyimide A partially cured whit...

Embodiment 2

[0065] Weigh flexible amorphous linear saturated polyester (product model Vitel3300B, manufactured by Bostik Company), 65 parts by weight; hard amorphous linear saturated polyester (product model Vitel2200B, manufactured by Bostik Company), 35 parts by weight; blocked isocyanate Curing agent (commodity model 1530, manufactured by Bostik Company), 5 parts by weight; Rutile type titanium dioxide (commercial model TRONOX CR828, product of Kemeiji Co., Ltd., Australia), 110 parts by weight; Defoamer (commodity model BYK-57, BYK Company product), 0.5 parts by weight, adjust the solid content of the glue solution to 48% with a methyl ethyl ketone solvent, and mix it into a white resin composition.

[0066] The white resin composition is coated on a PEN film with a thickness of 12.5 μm by a coating machine, and the thickness of the coating is 13 μm, and then baked in an oven at 160° C. for 5 minutes to form a partially cured white resin on the PEN film. The composition layer is coate...

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Abstract

The invention relates to a resin composition and a method for preparing an FPC coverlay by using the same. The resin composition comprises the following components in part by weight: 50 to 70 parts of flexible saturated polyester, 30 to 50 parts of hard saturated polyester, 1 to 20 parts of enclosed isocyanate curing agent, 15 to 150 parts of pigment, 15 to 120 parts of inorganic filler, 0.5 to 2.5 parts of antifoaming agent, and 5 to 30 parts of organic solvent. The resin composition is applied to the FPC coverlay in a flexible printed circuit. The resin composition has the characteristics of excellent weather resistance, high covering power, high flexibility and adhesiveness, and the like. The method for preparing the FPC coverlay by using the same can realize the one-off coating of the FPC coverlay on the flexible printed circuit, has the advantages of simple manufacturing method, low cost and high yield, and can realize the continuous production and obviously improve the production efficiency. The FPC coverlay produced by the method can improve the contrast ratio of an LED rope light under the action of an insulating base film besides excellent dust prevention, corrosion resistance, weather resistance and other characteristics.

Description

technical field [0001] The invention relates to a resin composition for flexible printed circuits, in particular to a resin composition for flexible printed circuit (FPC) cover films and a method for preparing FPC cover films using the resin composition. Background technique [0002] With the development of the information and communication industry, the rapid development of the microelectronics industry has been driven, and the flexible printed circuit (Flexible Printed Circuit, FPC) has emerged and developed rapidly. field has been widely used. The biggest difference between flexible printed circuit boards (Flexible Printed Circuit Board, FPCB) and rigid printed circuit boards (PCB) is that the former uses a cover film, and the function of the cover film is beyond the solder resist ink used in PCB. Welding function and make FPC free from dust, moisture and chemicals, and reduce the influence of stress during bending. In addition, with the development of FPC market, FPC co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/00C08K13/02C08K5/29C08K3/22H05K1/02H05K3/28
Inventor 鹿海华茹敬宏伍宏奎刘生鹏
Owner GUANGDONG SHENGYI SCI TECH
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