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Physicochemical and biochemical treatment method of chemical copper plating waste water

A technology for electroless copper plating and biochemical treatment, applied in metallurgical wastewater treatment, chemical instruments and methods, oxidized water/sewage treatment, etc. Guaranteed, strong adsorption, the effect of reducing the treatment cost

Active Publication Date: 2010-06-30
深圳市宝安东江环保技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] To sum up, at present, there has been no major progress in the treatment of electroless copper plating wastewater. Relevant research has mainly focused on the recycling of heavy metals or the treatment of only one of the pollutants. With the current growth of my country's circuit board industry , there is an urgent need for this practical and effective treatment method for wastewater from circuit board factories

Method used

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  • Physicochemical and biochemical treatment method of chemical copper plating waste water
  • Physicochemical and biochemical treatment method of chemical copper plating waste water

Examples

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example 1

[0054] Example 1 Treatment of Conventional Electroless Copper Plating Wastewater

[0055] Get 500ml of electroless copper plating wastewater, its water quality parameters are shown in Table 1, the pH value of the wastewater is adjusted to about 3.5, according to the COD Cr Add 15ml of hydrogen peroxide (30%) thereto at the ratio of concentration 1.5:1, and add 1g of ferrous sulfate heptahydrate therein, adopt the mode of magnetic stirring to react for 1 hour, adjust the pH to 7.5, and add about 10ml of PAM ( Concentration 1‰) to stand still for 10 minutes and filter, then add DTCR heavy metal scavenger to the effluent water according to the ratio of 20-30 times the residual heavy metal ions (about 60g / t), and add appropriate amount of PFS and PAM to it and stir for 15 minutes, then Filter out the water.

[0056] After the wastewater is treated, the relevant water quality parameters of the effluent are as follows:

[0057] Table 3 Water quality parameters after conventional e...

example 2

[0059] Example 2 Treatment of High Concentration Electroless Copper Plating Wastewater

[0060] Take 500ml of conventional electroless copper plating wastewater, add 3.0g of sodium sulfide to magnetically stir for 10min and filter, then adjust the pH to below 2.0 to precipitate EDTA, magnetically stir for 30min and filter the precipitated material, enter the Fenton oxidation stage, add 75ml of hydrogen peroxide to the wastewater (30%) and 2g of ferrous sulfate heptahydrate were magnetically stirred for 1 hour, after the reaction was complete, the pH was adjusted to about 7.5, and 20ml of PAM (concentration 1‰) was added thereto and left to stand for 10min before filtering. At this point, the physical and chemical treatment of waste water is completed, and it enters the biological reaction section after being diluted by 3 times. The residence time of the anaerobic reaction section is controlled at 6 days, the feed is 500ml per day, the pH is controlled between 7-8, and the stir...

example 3

[0063] Example 3 Treatment of Mixed Electroless Copper Plating Wastewater

[0064] Circuit board manufacturers often mix various types of wastewater into the same wastewater pool after the wastewater is generated. The wastewater not only includes electroless copper plating wastewater, but may also contain other types of wastewater. The nature of the mixed wastewater will be more complicated. Therefore, for this The research on similar wastewater will have greater practical significance. The water quality parameters of representative water samples are as follows:

[0065] Table 5 Water quality parameters of mixed electroless copper plating wastewater

[0066] project

pH

Formaldehyde (mg / l)

EDTA (g / l)

COD Cr (mg / l)

Cu(mg / l)

Ni(mg / l)

concentration

8.0

not detected

0.68

1258.03

913.00

15.10

[0067] The present invention learns from the treatment process similar to high-concentration electroless copper ...

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Abstract

The invention relates to a novel process for treating chemical copper plating waste water by combining a physicochemical method and a biological method. The waste water is divided into conventional chemical copper plating waste water and high-concentration chemical copper plating waste water. After the conventional chemical copper plating waste water is treated by copper deposition through sodium sulfide and Fenton oxidation, the effluent CODCr is reduced below 150mg / l; after the high-concentration chemical copper plating waste water is treated by copper deposition through sodium sulfide, EDTA acid precipitation, Fenton oxidation and biological anaerobic and aerobic treatment, the CODCr value can be reduced below 100mg / l; and other pollutants are well treated. By adopting the method of the invention, in the two kinds of the chemical copper plating waste water, the maximum removing rate of the CODCr can respectively reach 97.55% and 99.17%, and the removing rates of copper and nickel (heavy metals) can respectively reach 99.98% and 98.92%. The method provides a novel treatment way for the chemical copper plating waste water which is generated in circuit board industries and can not be easily treated, realizes the purpose of effectively treating various pollutants, and fully recycles various effective resources in waste water simultaneously.

Description

technical field [0001] The invention is mainly aimed at the treatment of electroless copper plating wastewater in circuit board factories, especially the treatment of pollutants and the recycling of valuable resources. Background technique [0002] Electroless plating, also known as self-catalytic plating, refers to a surface treatment technology that uses an appropriate reducing agent to chemically deposit a metal or alloy coating on the surface of a substrate without the presence of an external current, so it is also called no electricity. Electroplating or electroless plating. The composition of the electroless copper plating solution is relatively complex, mainly composed of copper salts, complexes, reducing agents and other additives. Among these substances, copper sulfate is used as a copper source to provide heavy metal ions for the plating solution; formaldehyde acts as a reducing agent. In the process of copper plating, copper ions are reduced to metallic copper; s...

Claims

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Application Information

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IPC IPC(8): C02F9/14C02F1/66C02F1/58C02F1/72C02F3/30C02F103/16
Inventor 王治军孙业政邓华利
Owner 深圳市宝安东江环保技术有限公司
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