Method for recovering metallic copper in mud by using microorganism and special device

A technology of microorganisms and metal copper, applied in the field of metal copper, can solve the problems of polluted soil, surface and groundwater sources, high treatment costs, etc.

Inactive Publication Date: 2010-06-30
惠州市雄越保环科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When dealing with such high-concentration heavy metal-containing wastewater, limited by the limitations of various treatment technologies, a large amount of sludge containing high-concentration Cu and other metals will eventually be produced, which is hazardous waste, and high tr

Method used

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  • Method for recovering metallic copper in mud by using microorganism and special device
  • Method for recovering metallic copper in mud by using microorganism and special device
  • Method for recovering metallic copper in mud by using microorganism and special device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Experiment of leaching Cu in the sludge discharged from PCB cleaning wastewater treatment by T.f bacteria at room temperature

[0021] 1.1 Experimental design

[0022] The liquid culture medium of T.f bacterium is 9K medium composition (g / L): (NH 4 ) 2 SO 4 3,K 2 HPO 4 0.5, MgSO 4 ·7H 2 O 0.5, KCl 0.1, Ca(NO 3 ) 2 0.01, ferrous sulfate 40, adjust the pH to 3. Add 40L of the above culture medium into the reactor, and add 4kg of sludge (the Cu content is 11g·kg -1 ). Inoculate 2L of acclimatized T.f(B) bacterial solution (by measuring the turbidity on a spectrophotometer, the control strain density is about 5×10 8 unit / ml), turn on the heater, and the stirrer controls the stirring speed to 200rpm / min.

[0023] The total culture time was 6 days (days), and samples were collected every day to determine the Cu content in the leaching solution.

[0024] 1.2 Determination method

[0025] First use aqua regia (HCl:HNO 3 =3:1) Digest the sludge and leaching solut...

Embodiment 2

[0030] T.t bacteria leaching Cu in sludge discharged after electroplating cleaning wastewater treatment at room temperature

[0031] 2.1 Experimental design

[0032] The composition of T.t bacteria culture medium is (g / L): (NH 4 ) 2 SO 4 0.5,K 2 HPO 4 4. MgSO 4 ·7H 2 O 0.5, CaCl 0.3, sulfur powder 5g, water 1000ml, adjust the pH to 2.5. 40L of the above-mentioned culture medium was added into the reactor, and 4kg of sludge (with a Cu content of 23g·kg -1 ). Inoculate 2L of domesticated T.t bacteria solution (by measuring the turbidity on a spectrophotometer, the control strain density is about 9×10 7 unit / ml), turn on the heater and aerator, and the stirrer controls the stirring speed to 400rpm / min.

[0033] The total incubation time was 9 days, and samples were collected every day to determine the Cu content in the leachate.

[0034] 2.2 Determination method

[0035] First use aqua regia (HCl:HNO 3 =3:1) Digest the sludge and leaching solution in a 50ml colorim...

Embodiment example 3

[0040] Combined leaching of Cu from sludge discharged from PCB industry by T.f and T.t bacteria at room temperature

[0041] 3.1 Experimental design

[0042] The composition of the medium is (g / L): (NH 4 ) 2 SO 4 3,K 2 HPO 4 0.5, MgSO 4 ·7H 2 O0.5, KCl 0.1, Ca(NO 3 ) 2 0.01, ferrous sulfate 22g, sulfur powder 2g, water 1000ml, adjust the pH to 2.5. Add 300L of the above culture medium into the reactor, and add 30kg of sludge (the Cu content is 18g·kg -1 ). Inoculate 15L of domesticated T.f and T.t bacteria liquid (by measuring the turbidity on the spectrophotometer, the control strain density is about 5×10 8 unit / ml), turn on the heater and aerator, and the stirrer controls the stirring speed to 400rpm / min.

[0043] The total incubation time was 5 days, and samples were collected every day to determine the Cu content in the leachate.

[0044] 3.2 Determination method

[0045] First use aqua regia (HCl:HNO 3 =3:1) Digest the sludge and leaching solution in a 5...

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Abstract

The invention relates to a method for recovering metallic copper in mud generated after production of a circuit board and/or treatment of electroplating rinse-waste water by using a microorganism and a special device. The method comprises the following steps: A, adding a culture medium into a reactor, inoculating a pre-cultured T.f bacteria and T.t bacteria inoculation liquid, starting a heating system and pre-culturing the mixture for 1+/-0.5 day to obtain a reaction liquid; B, adding the mud into the reaction liquid obtained in the step A with stirring, starting an aeration machine to culture the mixture for 3 to 10 days, opening a valve at the bottom of the reactor, then pumping a leaching agent which contains mud granules from the reactor with stirring, filtering the mud granules with a filter press to obtain the metallic leaching agent; and C, after extracting and condensing the metallic leaching agent obtained in the step B, allowing the metallic leaching agent to enter an electrolytic bath for electrolysis to obtain copper with the purity of over 99 percent, or directly evaporating the concentrated liquor to obtain high-purity CuSO4. The method has the advantages of simple technique, low cost and environmental friendliness.

Description

technical field [0001] The invention belongs to the fields of waste liquid resource treatment and nonferrous metal recovery. In particular, it relates to a method and a special device for recovering metal copper in sludge produced after the production of circuit boards or electroplating cleaning wastewater by using microorganisms. Background technique [0002] The circuit board is an important basic component for various electronic and electrical products to realize various functions, and my country is a big country in the production of circuit boards. In 2008, the global PCB output value was 48.2 billion US dollars, and China accounted for about 31% of the global output value, with an output value of 15 billion US dollars, an annual growth rate of 9.5%, and the growth rate ranked first in the world. According to incomplete statistics, there are more than 10,000 electroplating factories in my country, and the annual discharge of electroplating wastewater is about 4 billion ...

Claims

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Application Information

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IPC IPC(8): C22B3/18C25C1/12C01G3/10
CPCY02P10/20
Inventor 白建峰毛文雄
Owner 惠州市雄越保环科技有限公司
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