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Preparation method of double-pulse plating solution of single metal Au, Sn and Au-Sn alloy soldering flux

A double-pulse, single-metal technology, applied in the field of solder preparation, can solve the problems of many additives in the electroplating solution, large internal stress of the coating, and fast electroplating rate, and achieve the effect of less pores, uniform coating thickness and moderate electrodeposition rate.

Inactive Publication Date: 2010-09-15
HEFEI UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the electroplating rate is too fast, the internal stress of the coating is large, and the electroplating solution contains more additives, which requires high temperature and high energy consumption during plating, which is not conducive to large-scale use.

Method used

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  • Preparation method of double-pulse plating solution of single metal Au, Sn and Au-Sn alloy soldering flux
  • Preparation method of double-pulse plating solution of single metal Au, Sn and Au-Sn alloy soldering flux
  • Preparation method of double-pulse plating solution of single metal Au, Sn and Au-Sn alloy soldering flux

Examples

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Effect test

Embodiment 1

[0028] Embodiment 1: the preparation of the Au-Sn alloy soft solder that is rich in Sn

[0029] Potassium chloroaurate, sodium sulfite and triammonium citrate are used for electroplating Au single metal layer. Dissolve 3.4g of triammonium citrate in 50ml of deionized water, stir until completely dissolved, add 0.46g of potassium chloroaurate, stir for 20 minutes until completely dissolved, then add 0.72g of sodium sulfite, and stir until completely dissolved to obtain Light yellow and transparent Au electroplating solution; tin protochloride dihydrate and triammonium citrate are used for electroplating Sn single metal layer. Dissolve 5.4g of triammonium citrate in 50ml of deionized water, stir until completely dissolved, add 2.45g of stannous chloride dihydrate, stir for 15 minutes until completely dissolved, then add 0.1g of gelatin, stir until completely dissolved, that is A colorless and transparent Sn electroplating solution was obtained. Chemicals were of analytical or ...

Embodiment 2

[0033] Embodiment 2: the preparation of the Au-Sn alloy hard solder that is rich in Au

[0034] Sodium chloroaurate, sodium sulfite and triammonium citrate are selected for electroplating Au single metal layer. Dissolve 3.4g of triammonium citrate in 50ml of distilled water, stir until completely dissolved, then add 0.44g of sodium chloroaurate, stir for 20 minutes until completely dissolved, then add 0.73g of sodium sulfite, stir until completely dissolved, and obtain shallow Yellow transparent Au electroplating solution; tin protochloride dihydrate and sodium citrate are used for electroplating Sn single metal layer. Dissolve 6.7g of sodium citrate in 50ml of distilled water, stir until completely dissolved, then add 2.45g of stannous chloride dihydrate, stir for 15 minutes until completely dissolved, then add 0.1g of gelatin, stir until completely dissolved, and obtain Color transparent Sn plating solution. Chemicals were of analytical or chemical purity. The prepared Au...

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Abstract

The invention discloses a preparation method of a double-pulse plating solution of single metals Au and Sn and an Au-Sn alloy soldering flux. In the method, Au plating solution of chloraurate-sulfite-citrate-based and Sn plating solution of stannous chloride-citrate-gelatin-based are adopted, the Au plating solution and the Sn plating solution are electrolyzed by double-pulse alternating plating technology to prepare an Au layer and an Sn layer having different thickness (different ingredients), and the Au-Sn alloy soldering flux is then obtained after refluxing. The Au plating solution and the Sn plating solution have simple ingredients, which are nontoxic and stable; the electrodeposition rate is moderate, and the internal stress of the plating layer is small; the Au-Sn soldering flux obtained after refluxing has few apertures, compact structure, and evenly distributed ingredients, so that perfect face-down welding of semiconductor material can be directly achieved.

Description

technical field [0001] The invention belongs to the technical field of solder preparation, and relates to an electroplating solution of Au and Sn and a method for preparing Au-Sn alloy solder by double-pulse alternating electroplating technology. Background technique [0002] Although Au-Sn alloy solder is expensive, it has special applications in the field of optoelectronic and microelectronic device packaging because of its superior mechanical and thermal properties. [0003] "Journal of Electronic Materials" (Journal of Electronic Materials, 29, 2000, 1038-1046) reported that the Au-20wt.% Sn alloy solder layer was laid on the electroplated Cu substrate by flux method, and Au-Sn alloy solder layer could be obtained after reflow. solder joints. This method is low in process cost, simple and easy to implement. However, the arrangement density and thickness of Au-Sn solder joints prepared by this method are difficult to control, the degree of integration is difficult to im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/18C25D3/48C25D3/30
Inventor 汤文明黄书斌
Owner HEFEI UNIV OF TECH
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