Electrolyte of electroplating palladium-nickel alloy

A technology of electrolyte and alloy, applied in the field of electrolyte, can solve problems such as no industrial application of palladium-nickel alloy

Inactive Publication Date: 2010-09-22
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the palladium-nickel alloy coating with a nickel mass content of about 20% has been widely used, but the palladium-nickel alloy with a high nickel mass content has no industrial application

Method used

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  • Electrolyte of electroplating palladium-nickel alloy
  • Electrolyte of electroplating palladium-nickel alloy
  • Electrolyte of electroplating palladium-nickel alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 1) The composition of the plating solution and the electroplating conditions are as follows

[0035] Palladium dichloride (calculated as palladium) 2g / L

[0036] Nickel sulfate hexahydrate 25g / L

[0037] Ammonium chloride 30~50g / L

[0038] Boric acid 40~50g / L

[0039] Ammonia 30~60ml / L

[0040] Sodium dodecylsulfonate 0.1~0.5g / L

[0041] Proynyl alcohol 0.05~0.4g / L

[0042] Saccharin 0.1~0.5g / L

[0043] pH (adjusted with ammonia water) 6.5~8

[0044] Current density 0.5~1A / dm 2

[0045] Temperature 45°C

[0046] Anode Platinized titanium mesh

[0047] The area ratio of cathode to anode is 1:2

[0048] Stir at medium speed during plating.

[0049] 2) Coating test results: see Table 1, contact resistance evaluation standard: SJ2431-84, the general gold coating contact resistance is less than 0.6mΩ.

[0050] Table 1

[0051]

Embodiment 2

[0053] 1) The composition of the plating solution and the electroplating conditions are as follows

[0054] Tetraammine palladium sulfate (calculated as palladium) 6g / L

[0055] Nickel chloride hexahydrate 25g / L

[0056] Sodium chloride 30~50g / L

[0057] Sodium pyroborate decahydrate 50~80g / L

[0058] Ethylenediamine 10~30g / L

[0059] Sodium dodecylsulfonate 0.1~0.5g / L

[0060] Niacin 0.05~0.4g / L

[0061] Sodium benzenesulfinate 0.05~0.5g / L

[0062] pH (adjusted with ammonia water) 6.5~7.5

[0063] Current density 1~1.5A / dm 2

[0064] Temperature 50°C

[0065] anode graphite

[0066] The area ratio of cathode to anode is 1:2

[0067] Stir at medium speed during plating.

[0068] 2) Coating test results: see Table 2.

[0069] Table 2

[0070]

Embodiment 3

[0072] 1) The composition of the plating solution and the electroplating conditions are as follows

[0073] Ammonium palladium nitrite (as palladium) 8g / L

[0074] Nickel sulfamate 40g / L

[0075] Ammonium sulfate 30~60g / L

[0076] Boric acid 30~40g / L

[0077] Glycine 15~30g / L

[0078] Acrylamide 0.2~0.5g / L

[0079] Niacinamide 0.05~0.4g / L

[0080] Sodium dodecylsulfonate 0.05~0.5g / L

[0081] pH (adjusted with ammonia water) 7~9

[0082] Current density 1~1.5A / dm 2

[0083] Temperature 30°C

[0084] Anode stainless steel

[0085] The area ratio of cathode to anode is 1:3

[0086] Stir at medium speed during plating.

[0087] 2) Coating test results: see Table 3.

[0088] table 3

[0089]

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PUM

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Abstract

The invention relates to electrolyte of an electroplating palladium-nickel alloy, in particular to electrolyte. The invention provides electrolyte which can electroplate bright, compact and needle-hole-free electroplating palladium-nickel alloy with different nickel contents (10 to 40 percent), which comprises major salt, complexing agent, additive, conductive salt and pH stabilizer; the major salt comprises a palladium salt and a nickel salt, calculating at the metal palladium, the content of the palladium salt is 1 to 10 g/L, and the mol ratio of the palladium salt and the nickel slat is 1: 1 to 3; the concentration of the complexing agent is 0.2 to 1.0 mol/L; the content of the additive is 0.01 to 1.0 g/L; the content of the conductive salt is 20 to 100 g/L; and the pH stabilizer is of 20 to 50 g/L boric acid or 30 to 90 g/L pyroborate.

Description

technical field [0001] The invention relates to an electrolytic solution, in particular to an electrolytic solution for electroplating a palladium-nickel alloy. Background technique [0002] Gold has excellent corrosion resistance, electrical conductivity and ductility, and is widely used as a finishing metal for electrical contacts and connectors in the electronics industry. The price of gold is expensive, and the search for substitutes for gold plating to save costs has aroused widespread concern. Many properties of palladium are similar to gold, such as corrosion resistance, ductility, etc., and palladium is cheaper, has a lower density, and its application cost is much lower than that of gold. The palladium alloy coating can not only further reduce the cost, but also significantly reduce the hydrogen absorption phenomenon of the pure palladium coating, and improve the ductility, wear resistance, contact resistance and brightness of the palladium coating. Therefore, pal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56
Inventor 杨防祖岳俊培田中群姚士冰许书楷陈秉彝周绍民
Owner XIAMEN UNIV
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