Formula and production process of diamond ultrathin cutting blade used for cutting in processing of electronic encapsulated components
An electronic packaging and ultra-thin slicing technology, which is applied in metal processing equipment, manufacturing tools, grinding devices, etc., can solve the problems of inability to produce shape blades, anisotropy of blades, and low production efficiency, so as to improve cutting efficiency and cutting Good sharpness, toughness and density
Inactive Publication Date: 2010-10-20
XIAN ZEHAO IND
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Problems solved by technology
Although the quality of diamond slices produced by this process is stable, dense and fine, there are the following disadvantages: ①The blade has anisotropy; ②It cannot produce blades with complex shapes and holes; ③Long production cycle, low production efficiency, high production cost
Method used
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Embodiment 1
[0032] First, according to the ratio, the diamond content of 0.88G / CBM diamond abrasive is calculated according to the volume of the blade to calculate the accurate weight, and then the following weight percentage of the copper powder adhesive is 55%, the average particle size is 0.46μm, and the auxiliary filler tin 15% silver powder, 15% zinc oxide powder, 6.5% zinc oxide powder, 3% carbon powder, 5% iron powder, plus 0.5% graphite powder for batching, the sum of adhesive and auxiliary metal filler is 100%, the average particle size of diamond powder is 0.46 μm.
[0033] Then according to the production process of the composite diamond slice: 1) mixing ingredients; 2) feeding into the mold; 3) pre-pressing and fixed mold hot pressing; 4) unloading and hardening; 5) atmosphere protection cooling; 6) mechanical processing; 7 ) product inspection; 8) branding and packaging storage.
[0034] Its manufacturing process steps are as follows:
[0035] 1) Mixed ingredients:
[0036...
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Abstract
The invention relates to a blade and a process, in particular to a formula and a production process of a diamond ultrathin cutting blade used for cutting in the processing of electronic encapsulated components. The invention is characterized in that: the cutting blade is prepared by using copper powder as a bonding agent and mixing the copper powder with auxiliary metal fillers; based on a total percentage of 100 percent of the copper powder and the auxiliary metal fillers, the copper powder bonding agent, of which the average particle size is 0.46 micrometers, accounts for 55 percent, the tin powder auxiliary filler 15 percent, silver powder 15 percent, zinc oxide powder 6.5 percent, carbon powder 3 percent, iron power 5 percent and added graphite powder 0.5 percent; and according to the volume of the blade, a diamond grinding material of which the diamond content is 0.88G / CBM is add to be mixed with the auxiliary metal fillers and the bonding agent. The production process of the composite diamond cutting blade comprises: 1) mixing and material preparation; 2) mold filling and material feeding; 3) pre-pressing and fixed-mold hot pressing; 4) mold release and hardening; 5) protective-atmosphere cooling; 6) machining; 7) product inspection; and 8) ironing, packing and warehousing. The blade has a low compatibility with steel like materials, low cutting wettability and small friction with machined materials and therefore has a prolonged service life.
Description
technical field [0001] The invention relates to a blade and a process, in particular to a diamond ultra-thin slice formula and a production process for cutting electronic packaging components. Background technique [0002] Composite diamond slices have excellent wear resistance, high temperature resistance, corrosion resistance and other characteristics, but at the same time have disadvantages such as low strength and insufficient toughness. Adding additives to composite diamond is an effective method to improve the strength and toughness of diamond materials, and the composite diamond slices prepared by this method have higher strength, toughness and density. [0003] The traditional method of manufacturing composite diamond slices is the hot pressing method (HP), that is, under certain process conditions, the metal powder is hot pressed into a cake-shaped sintered body, and then cut into the required shape by wire cutting or diamond grinding wheel, and then pressed accordi...
Claims
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IPC IPC(8): B24B27/06B24D3/06B24D18/00
Inventor 张庚超
Owner XIAN ZEHAO IND