Electrolyte vacuum boiling type high speed electro-deposition method and device thereof

A technology of vacuum boiling and electrolyte, applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problems of harmful oxides, slow deposition speed, low deposition speed, etc. good quality effect

Inactive Publication Date: 2010-10-27
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Typical electrodeposition defects are: pinholes, buildup, pitting, harmful oxides, hydrogen embrittlement, etc.
However, the above-mentioned vacuum electrodeposition process still needs to add additives, and the deposition rate is low, and defects such as pinholes and organic inclusions still exist
This is because this vacuum electroforming or electroplating method is mainly based on the efficient removal of gases and bubbles, which belongs to the partial improvement of the basis of conventional electrodeposition processes, and the environmental conditions and liquid phase mass transfer that lead to the formation of various deposition defects are limited. The problem has not been fundamentally solved, and problems such as thick diffusion layer, slow deposition rate, and additive decomposition still exist

Method used

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  • Electrolyte vacuum boiling type high speed electro-deposition method and device thereof
  • Electrolyte vacuum boiling type high speed electro-deposition method and device thereof
  • Electrolyte vacuum boiling type high speed electro-deposition method and device thereof

Examples

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Embodiment 1

[0046] The concrete operating steps of the inventive method are:

[0047] a. The negative electrode 3 that thermocouple 5 is housed is fixedly pasted on the stainless steel heating plate 4 (heating plate 4 is fixed on the side wall of electrodeposition tank 1) that has corrosion-resistant electric insulating layer outside, then the electrolysis with anode bag The nickel anode plate 2 is fixed on the side wall of the electrodeposition tank 1 (wherein the anode and the cathode are relatively horizontally arranged up and down, the distance between the two is 35mm, the area ratio of the anode and the cathode is 2.5:1, and the cathode 3 and the anode 2 are respectively connected to the power supply 16 Negative and positive poles), add an appropriate amount of sulfamate electrolyte 22 to the electrodeposition tank 1 (see Table 1 for the composition of the electrolyte, the liquid level of the electrolyte added exceeds the upper surface of the anode by 25 mm) and then seals the electro...

Embodiment 2

[0055] In this embodiment, the current density used is 51A / dm 2 , other implementation steps and electroforming conditions are the same as in Example 1.

[0056] Table 2 Microhardness and deposition rate of Example 1, Example 2 and contrast nickel sheet

[0057]

[0058] Note: Operating conditions of Example 1: vacuum degree 5kPa, electrolyte temperature 35°C, cathode surface temperature 65°C, current density 7A / dm 2 ;Example 2 Operating conditions: vacuum degree 5kPa, electrolyte temperature 35°C, cathode surface temperature 65°C, current density 51A / dm 2 ;Contrast nickel sheet operating conditions: normal pressure, electrolyte constant temperature 50 ℃, current density 7A / dm 2 .

[0059] The topography of the electrodeposited nickel sheet prepared by the method described in Example 2 is shown in Figure 5 , the microhardness of the nickel sheet and the deposition rate during the electroforming process are shown in Table 2. Depend on Figure 5 It can be see...

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Abstract

The invention relates to an electrolyte vacuum boiling type high speed electro-deposition method. The method comprises the following steps of: a, fixing an anode and a cathode in an electro-deposition tank, adding a suitable amount of additive-free electrolyte to the electro-deposition tank, and sealing the electro-deposition tank, starting an electrolyte recycle filter system and an electrolyte state observing system, starting an electrolyte temperature control system and a cathode face temperature control system, and respectively controlling the temperature of the electrolyte in the tank to be 25-40 DEG C and the temperature of the cathode face at 55-70 DEG C; b, starting an electro-deposition tank vacuum degree control system, vacuumizing the electro-deposition tank and adjusting the vacuum degree in the tank to enable the electrolyte close to the surface of the cathode face to boil; and c, starting the power supply to carry out the electro-deposition, till the coating reaches the demanded thickness. The invention also discloses a device for carrying out the above electro-deposition method. A coating or a component with fewer defect, fine crystal particle, good compactness, and polished surface can be rapidly produced by electro-depositing under the condition without additive by the method of the invention. The invention is adapted to common machining situations, such as the electroplating, electroforming, electro-brush plating and the like, as well as the micro machining situation.

Description

technical field [0001] The invention belongs to the field of electrochemical processing, and in particular relates to a vacuum boiling high-speed electrodeposition method and device of an electrolyte. Background technique [0002] The electrochemical deposition technology that uses the redox reaction under the action of an electric field to realize the "stacking" film formation or structure formation of metal atoms has the advantages of wide application materials, good process controllability, low process temperature, and less equipment investment. It is widely used in industrial production. Commonly used electrodeposition techniques are: electroplating, electroforming, brush plating, etc. [0003] At present, many deposition defects and slow deposition speed are two major technical problems in the field of electrodeposition. Typical electrodeposition defects are: pinholes, buildup, pitting, harmful oxides, hydrogen embrittlement, etc. These defects seriously affect the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25D19/00C25D21/12
Inventor 明平美姜无疾郑建新李英杰吕印定王艳丽李松昭
Owner HENAN POLYTECHNIC UNIV
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