Biphenyl-structure-contained epoxy resin/montmorillonite nano composite material

Abstract

The invention relates to a biphenyl-structure-contained epoxy resin / montmorillonite nano composite material belonging to the field of nano composite material preparation and research. The biphenyl-structure-contained epoxy resin / montmorillonite nano composite material is prepared by the following steps of: stirring and refluxing cetyltrimethylammonium bromide and calcium montmorillonite; decompressing and filtering to obtain organic montmorillonite, wherein, the interlamellar spacing is equal to 2.21 nm); adding the organic montmorillonite to the biphenyl-structure-contained epoxy resin in a certain proportion; introducing an ultrasonic technology and an improved curing process in 3,3',5,5'-tetramethyl hydroquinone diglycidyl ether so as to effectively strip off and evenly disperse the nano sheet layers of the organic montmorillonite in a epoxy resin substrate; introducing 4,4'-oxydianiline benzophenone which is a solidifier in a high-rigidity structure; and preparing stripping-type biphenyl-structure-contained epoxy resin / montmorillonite nano composite material with low cost and favorable heat resistance, wherein the interlamellar spacing is larger than 8.8 nm and Tg is equal to 469 K. The invention overcomes the problem of poor thermal resistance of a bisphenol A-type epoxy resin / montmorillonite nano composite material and can be applied as a high-performance electronic encapsulating material to satisfy the needs of the microelectronic industry.

Description

technical field [0001] The invention is a low-cost epoxy resin / montmorillonite nanocomposite material with biphenyl structure and good toughness and heat resistance, which belongs to the research field of nanocomposite preparation. Background technique [0002] At present, the research on epoxy resin / clay nanocomposites at home and abroad mainly focuses on the intercalation composite of bisphenol A epoxy resin and sodium montmorillonite, which has obtained good mechanical properties; but bisphenol A epoxy The rigidity of resin / montmorillonite nanocomposites is poor, and its glass transition temperature is low, and its heat resistance is not good, while the epoxy resin used for packaging materials needs to have good heat resistance and moisture absorption; improve the resistance Thermal properties can take two approaches: the introduction of epoxy resin with rigid structure and curing agent with high rigid structure; the introduction of high rigid heat-resistant groups can ef...

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Problems solved by technology

[0002] At present, the research on epoxy resin / clay nanocomposites at home and abroad mainly focuses on the intercalation composite of bisphenol A epoxy resin and sodium montmorillonite, which has obtained good mechanical properties; but bisphenol A epoxy The rigidity of resin / montmorillonite nanocomposites is poor, and its glass transition temperature is low, and its heat resistance is not good, while the epoxy resin used for packaging materials needs to have good heat resistance and moisture absorption; improve the resistance Thermal properties can take two approaches: the introduction of epoxy resin with rigid structure and curing agent with high rigid structure; the introduction of high rigid heat-resistant groups can effectively increase the glass transition temperature of the cured product, so that the prepared composite material With better heat resistance, it can be applied as a high-performance electronic packaging material to meet the needs of the microelectronics industry

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