High-conversion rate silicon crystal and thin film compound type unijunction PIN (Positive Intrinsic-Negative) solar battery and manufacturing method thereof
A solar cell, high conversion rate technology, applied in the field of solar cells
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Embodiment 1
[0060] Example 1: A silicon crystal and thin film compound single-junction PIN solar cell single-junction six-layer pin structure thin-film solar cell, the structure is:
[0061] Bottom electrode / n-type gradient μc or epi Si 1-x Ge x / n-type silicon wafer / i-μc-Si / i-A-Si 1-x Ge x / i-A-Si / i-μc-SiC / p-A-SiC / TCO / anti-reflection coating.
Embodiment 2
[0062] Embodiment 2: preparation method
[0063] a. High-conversion silicon crystal and thin-film composite single-junction PIN solar cells Single-junction six-layer pin structure thin-film solar cells, the structure is: bottom electrode / n-type gradient g μc or epi Si 1-x Ge x / n-type silicon wafer / i-μc-Si / i-A-Si 1-x Ge x / i-A-Si / i-μc-SiC / p-A-SiC / TCO / anti-reflection coating.
[0064] b. Preparation process:
[0065] 1. Chemical and mechanical (CMP) double-sided polishing of n-type silicon wafers (monocrystalline or polycrystalline); then,
[0066] 2. Cleaning of n-type silicon wafers (single crystal silicon wafers or polycrystalline silicon wafers);
[0067] 3. Use PECVD to form silicon-rich silicon oxide or TCO intermediate reflection layer film;
[0068] 4. On the front side of n-type silicon wafers (single crystal silicon wafers and polycrystalline silicon wafers), deposit phosphorus (P) doped n-type Ge by CVD method, and n-type gradient μc or epi Si 1-x Ge x Thin f...
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