Preparation method of X8R-property slice type multilayer ceramic capacitor

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor electrodes, fixed capacitor parts, etc., can solve the problems of decreased density of dielectric ceramics, decreased product competitiveness, and decreased reliability of finished products, achieving The effect of promoting development, reducing production cost, and high reliability

Active Publication Date: 2012-05-09
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

There are already a few manufacturers in China that can produce them, but they all use the palladium-silver system as the raw material. The high price makes it unacceptable for most domestic automotive electronics and lighting electronics manufacturers, which leads to a decrease in product competitiveness and a small market share, which cannot change the domestic X8R products. The situation of demand dependence on imports
[0005] Therefore, some manufacturers try to reduce the palladium content in the internal electrode material to reduce product costs. However, as the sintering temperature of the low palladium content X8R-MLCC decreases, the density of the dielectric ceramic body decreases, resulting in a serious decline in the reliability of the final product.

Method used

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  • Preparation method of X8R-property slice type multilayer ceramic capacitor
  • Preparation method of X8R-property slice type multilayer ceramic capacitor
  • Preparation method of X8R-property slice type multilayer ceramic capacitor

Examples

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preparation example Construction

[0025] A method for preparing an X8R characteristic chip multilayer ceramic capacitor of the present invention includes preparation of porcelain slurry, making dielectric diaphragms, alternately overprinting inner electrodes and dielectric layers, drying blocks, laminating, cutting, debinding, sintering, pouring Steps such as cornering, capping, and burning.

[0026] In the preparation step of porcelain slurry, the porcelain material used adopts barium titanate structure porcelain material, and the main component is 95-99.9wt% of Ba, Ti composite oxide BaTiO 3 , the secondary component is 0.1-5wt% of one or more of Ca, Mg, Ce, La, Si, Y, Zr, Er, Ni, Nb oxides, which can be adjusted according to the actual situation, taking into account the temperature characteristics of the product, Insulation, withstand voltage, service life, etc., should also consider the impact on the sintering temperature of the product, and the total amount should be controlled at 0.1-5wt%. For example, ...

Embodiment

[0033] Specifically select the porcelain slurry of No. 1 to No. 5 formulations in Table 1, and the above-mentioned binders, plasticizers, dispersants, and defoamers are all substances commonly used by those skilled in the art. The solvents used were the formulations in Table 3. The performance parameters of the ceramic material after silk screen printing are shown in Table 2 corresponding to test numbers 1 to 5. Make 250V 1206-inch products with superior performance as shown in Table 4.

[0034] Table 1: Porcelain slurry formula (mass ratio of each component to porcelain powder)

[0035]

[0036] Table 2: Performance Parameters of Porcelain Cast Diaphragms

[0037]

[0038] From the ratios in Table 1 and the diaphragm comparison results in Table 2, the ratio corresponding to Test No. 4 is the best ratio.

[0039] Table 3: Formulation selection of solvents

[0040]

[0041] From the analysis of the above test results, it can be seen that when the ratio of toluene a...

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Abstract

The invention discloses a preparation method of an X8R-property slice type multilayer ceramic capacitor, comprising the following steps of: preparing ceramic slurry, making a dielectric membrane, alternately overprinting inner electrodes and dielectric layers, cutting, discharging glue, sintering, sealing ends and burning ends, wherein the used ceramic slurry in a barium titanate structure also comprises 0.1-5wt% of auxiliary components apart from BaTiO3 as a main component; the inner electrodes are made of nickel inner electrode materials; end electrodes are made of copper end electrode materials; and the sintering temperature is 1220 DEG C-1300 DEG C, and the sintering process comprises a temperature rise section, a high-temperature burning section, a temperature reducing section and a tempering section. As the X8R-property slice type multilayer ceramic capacitor is prepared by using materials of a base metal system for replacing expensive materials of a palladium silver system, theperformance reaches the level of X8R products of the palladium silver system, the upper-limit use temperature of the product reaches +150 DEG C, the change rate of the inner capacity in the temperature range of -55 DEG C-+150 DEG C is not greater than + / -15%, and the ceramic capacitor has high reliability and can effectively replace the X8R products of the palladium silver system; the method greatly reduces the production cost and saves scarce noble metal resources, and the producible capacity range of the product is wider than that of the materials of the palladium silver system.

Description

technical field [0001] The invention relates to chip electronic components, in particular to a method for preparing a chip multilayer ceramic capacitor with X8R characteristics. Background technique [0002] A capacitor is a component that can store electrical energy. It is one of the electronic components widely used in electronic equipment. It is widely used in DC blocking, coupling, bypass, filtering, tuning loops, control circuits, etc. Large and irreplaceable, its output accounts for more than 40% of the output of electronic components, and its output value accounts for more than 10% of the output value of electronic components. With the rapid development of electronic technology, especially the development of the whole machine industry, such as the continuous emergence of new electronic products represented by mobile phones, flat panel displays, automotive electronics, and lighting electronics, it has brought good development opportunities for the development of capaci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/008
Inventor 陆亨祝忠勇唐浩宋子峰陈长云安可荣
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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