Method for adhering coating on electronic element substrate

Abstract

The invention discloses a method for adhering a coating on an electronic element substrate. The method comprises the following steps of: a, material treatment, namely after mixing materials needing to be precipitated, sintering the mixture in a sintering furnace with nitrogen protection; and grinding the mixture into beta crystals after cooling; b, precipitation; and c, dip-coating. The film formed on the substrate by adopting a precipitation method first has the characteristics of smoothness, fineness, uniform thickness, no bubble or spot, and simple, convenient and easily-implemented operating method; and waste water can be recycled after returning to a water treatment system to be purified, so that the problem of environmental pollution is solved completely. The method guarantees the controllability of a product and improves production efficiency greatly; and taken photoconductive resistors as examples and calculated by millions of substrates, the method can finish the production within only 30 working hours and only 10 to 15 indirect working hours, reduce the waste defect rate 1 percent, save intensive human resources, and reduce cost.

Description

technical field [0001] The invention belongs to the technical field of chemical industry, and in particular relates to a method for adhering a coating on an electronic component substrate. Background technique [0002] In the production process of electronic components, the attachment method of "coating" of electronic components has been using the traditional "spraying" method, that is, using a special spray gun to repeatedly spray the prepared chemical solution onto the treated substrate. Form "coating", this traditional method is called "spraying method". The "spraying method" is widely used in the production of electronic components. For a long time, no better method can be found to replace it. It has become a major drawback in the development of the industry. The main problems are as follows: 1. Pollution of the environment. Harmful substances such as cadmium, lead, mercury, hexavalent chromium, polybrominated diphenyl ethers, and polybrominated biphenyls are used in th...

AI Technical Summary

Problems solved by technology

Due to the backward spraying process, the leakage, scattering, and volatilization of the harmful substances cannot be controlled, the residual preparations cannot be recovered, and the wastewater treatment is difficult, causing pollution within a certain range and affecting the health of workers

2. The adhesion of the coating is uneven, because it is a spraying method. No matter how you adjust the nozzle diameter of the spray gun, the injection pressure and the injection speed, the consistency of the coating thickness on the surface of the electronic components cannot be guaranteed, and the performance of the electronic components cannot be satisfied. performance, especially for products with relatively high precision requirements for electronic components, it cannot meet the needs

3. The production efficiency is low, the controllability of product quality is poor, and the product is highly discrete

As far as the production of photoresistors is concerned, it takes about 100 direct production man-hours (10,000 pcs / person-hour) for every million substrates invested; due to the poor controllability of the product, 1,000 indirect man-hours (1000 pcs / person-hour) need to be added , the rejection rate is around 30%

3. Serious waste of raw materials