Method for electroplating nano composite plated layer

A nano-composite and coating technology, which is applied in coatings, electrolytic coatings, electrolytic processes, etc., can solve the problems of nano-particle agglomeration and achieve the effects of fine and uniform grain size, convenient promotion and application, and simple operation

Inactive Publication Date: 2011-01-26
HENAN UNIV OF SCI & TECH
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Problems solved by technology

[0004] In order to solve the problem of nanoparticle agglomeration existing in the current nanocompos

Method used

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  • Method for electroplating nano composite plated layer
  • Method for electroplating nano composite plated layer
  • Method for electroplating nano composite plated layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Electroplating nickel-based Nd on stainless steel cathode substrate 2 o 3 Nanocomposite coatings are used as an example to illustrate.

[0039] Such as figure 1 Shown the present invention prepares the electroplating method of nanocomposite coating: will be added with Nd 2 o 3 The plating solution 4 of the nanoparticles 11 is placed in a dual-frequency ultrasonic field under the joint action of bath-type and probe-type ultrasonic waves, and the plating solution 4 is mechanically stirred to perform electroplating on the cathode 2 at the same time.

[0040] The specific steps of the electroplating method are as follows:

[0041] 1) Prepare the plating solution 4:

[0042] The basic plating solution used in the test consists of: nickel sulfate (NiSO 4 ·6H 2 O) 300g / L, boric acid (H 3 BO 3 ) 35g / L, ammonium chloride (NH 4 Cl) 20g / L, wetting agent (C 12 h 25 SO 4 Na) 0.5g / L, neodymium oxide (Nd 2 o 3 ) The nanoparticle diameter is 45nm, the addition amount i...

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Abstract

The invention discloses a method for electroplating a nano composite plated layer. The method comprises the following steps of: placing plating solution into which nano particles are added into a double frequency ultrasonic field under the combined action of bath type ultrasonic waves and probe type ultrasonic waves, simultaneously electroplating a cathode by using the plating solution in a mechanical stirring mode. Due to the combined action of double frequency ultrasonic waves and magnetic stirring on the plating solution during electroplating, the agglomeration probability of the nano particles is reduced to ensure that the nano particles and a base metal are codeposited; simultaneously the concentration polarization of the plating solution is reduced to ensure that the nano particles are distributed more uniformly in the plating solution. The nano composite plated layer prepared by the method has the advantages of fine and uniform base metal crystal grains and compact structure, and the hardness and resistance to high-temperature oxidation of the nano composite plated layer are improved; besides, the electroplating method has the advantages of simple operation, low electroplating cost and convenient popularization and application.

Description

technical field [0001] The invention belongs to the technical field of electrochemical surface engineering, and in particular relates to an electroplating method for nanocomposite coatings. Background technique [0002] Nano-composite electroplating is a new type of composite electroplating technology based on ordinary composite electroplating, which co-deposits insoluble solid particles with a nanoscale between 1 and 100nm and metal ions on the surface of the cathode to obtain a composite coating with special functions. . Due to the special properties of nanoparticles such as surface effect, volume effect, quantum size effect, and macroscopic quantum tunneling effect, the composite coating prepared by nanocomposite electroplating technology has many special properties. In recent years, it has developed rapidly in the field of metal surface treatment engineering technology. However, due to the small particle size and high surface energy of nanoparticles, agglomeration is e...

Claims

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Application Information

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IPC IPC(8): C25D15/00C25D5/20C25D21/10
Inventor 薛玉君李献会李伦刘红彬李济顺刘永刚马伟
Owner HENAN UNIV OF SCI & TECH
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