System and method for recycling and supplying mortar to multi-wire cutting machines

Abstract

The invention discloses a system and method for recycling and supplying mortar to multi-wire cutting machines. The system comprises a finished product mortar storage tank, a main supply pipeline, an auxiliary reflowing pipeline, a branch supply pipeline, a waste liquid back-pumping main pipeline, a waste liquid back-pumping branch pipeline, a waste liquid recycling tank, a mortar separation and purification device, a silicon carbide dense mortar storage tank, a recycled liquid storage tank, a silicon carbide dense mortar pumping pipeline, a recycled liquid pumping pipeline, a cutting liquid supplementing pipeline and a silicon carbide micropowder supplementing pipeline. The method comprises the following steps of: firstly, supplying finished product mortar: reflowing the finished product cutting mortar before the mortar is supplied to the multi-wire cutting machines, supplying the finished product cutting mortar, completing the supplying of the mortar, and then continuously reflowing the finished product cutting mortar; secondly, recycling waste mortar; and thirdly, starting a stirrer of a mortar recycling device, separating and purifying the waste mortar, compounding and recycling the finished product cutting mortar. The system is reasonably designed, simply and conveniently operated, can simultaneously supply the mortar to a plurality of cutting machines without retaining the mortar in each pipeline.

Description

technical field [0001] The invention belongs to the technical field of cutting mortar supply, and in particular relates to a multi-wire cutting machine mortar circulation and supply system and method. Background technique [0002] Multi-wire sawing is one of the most effective methods for cutting large-diameter silicon single crystal rods. In recent years, the multi-wire cutting machine (wire saw for short) that has sprung up suddenly has gradually replaced the inner circle cutting machine in the field of large-diameter silicon wafer processing due to its extremely high production efficiency and wafer output rate. Small degree, good parallelism, small total thickness tolerance (TTV) dispersion, small edge cutting loss, shallow surface damage layer, and small wafer surface roughness; its cutting materials cover various semiconductor materials, such as silicon, germanium, Lithium niobate, gallium arsenide, indium phosphide, artificial gemstones, silicon carbide, etc., so the ...

AI Technical Summary

Problems solved by technology

[0005] The multi-wire cutting machine uses a single machine as the working unit. The existing cutting mortar is to inject the finished mortar into the mortar tank of the multi-wire cutting machine manually. The solid matter in the mortar is brought into the mortar, which seriously affects the quality of the cut silicon wafers and causes different degrees of environmental pollution.

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