System and method for recycling and supplying mortar to multi-wire cutting machines
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAN HUAJING ELECTRONICS TECH
- Publication Date
- 2011-05-18
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of cutting mortar supply, and in particular relates to a multi-wire cutting machine mortar circulation and supply system and method. Background technique
[0002] Multi-wire sawing is one of the most effective methods for cutting large-diameter silicon single crystal rods. In recent years, the multi-wire cutting machine (wire saw for short) that has sprung up suddenly has gradually replaced the inner circle cutting machine in the field of large-diameter silicon wafer processing due to its extremely high production efficiency and wafer output rate. Small degree, good parallelism, small total thickness tolerance (TTV) dispersion, small edge cutting loss, shallow surface damage layer, and small wafer surface roughness; its cutting materials cover various semiconductor materials, such as silicon, germanium, Lithium niobate, gallium arsenide, indium phosphide, artificial gemstones, silicon carbide, etc., so the ...