High-heat-conductivity white adhesive composition, high-heat-conductivity white cover film made from same and preparation method thereof

A technology of high thermal conductivity and composition, which is applied in the field of high thermal conductivity white adhesive composition and high thermal conductivity white cover film, can solve the problems of limited application, and achieve the effects of good yellowing resistance, high thermal conductivity and low cost

Active Publication Date: 2011-06-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no public report on the preparation of thermally conductive white covering film, because the appearance of the disclosed thermally conductive insulating PI base film is yellow or other colors, and there is no white product, which limits its application in some fields.

Method used

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  • High-heat-conductivity white adhesive composition, high-heat-conductivity white cover film made from same and preparation method thereof
  • High-heat-conductivity white adhesive composition, high-heat-conductivity white cover film made from same and preparation method thereof
  • High-heat-conductivity white adhesive composition, high-heat-conductivity white cover film made from same and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Flexible linear saturated polyester (commodity model Vitel3300B, manufactured by Bostik Company) 68 parts by weight; Rigid linear saturated polyester (commodity model Vitel2200B, manufactured by Bostik Company) 32 parts by weight; Manufacture) 10 parts by weight; Rutile type titanium dioxide (commodity model TRONOX CR828, product of Ke Meiji Company, Australia) 90 parts by weight; Aluminum oxide (commercial model VK-L04R, Wanjing material) 40 parts by weight; Fluorescent whitening agent (commercial product Model OB-1, product of Eastman Company, USA) 0.08 parts by weight; defoamer (product model BYK-57, product of BYK Company) 0.4 parts by weight.

[0053] Feed saturated polyester and blocked isocyanate curing agent according to the above weight ratio with methyl ethyl ketone, stir evenly at high speed, then add pre-ultrasonic treated alumina, titanium dioxide, whitening agent, defoamer, etc., and stir for about 6 hours. Mixed into a highly thermally conductive white ad...

Embodiment 2

[0057] Except changing the consumption of blocked isocyanate curing agent, other proportioning is identical with embodiment 1. 15 parts by weight of blocked isocyanate curing agent (product model BL3475, manufactured by Bayer).

[0058] Feed saturated polyester and blocked isocyanate curing agent according to the above weight ratio with methyl ethyl ketone, stir evenly at high speed, then add pre-ultrasonic treated alumina, titanium dioxide, whitening agent, defoamer, etc., and stir for about 6 hours. Mixed into a highly thermally conductive white adhesive composition.

[0059] The composition is coated on the surface of a high thermal conductivity PI base film with a thickness of 25 μm by a glue coating machine, and the thickness of the coating is 25 μm, and then baked in an oven at 180 ° C for 2 minutes to obtain a high thermal conductivity white adhesive composition coating .

[0060] Then a high thermal conductivity epoxy resin adhesive composition with a thickness of 25...

Embodiment 3

[0062] Except for changing the amount of high thermal conductivity filler, other proportions are the same as in Example 1. Aluminum oxide (commodity model VK-L04R, Wanjing material) 50 parts by weight;

[0063] Feed saturated polyester and blocked isocyanate curing agent according to the above weight ratio with methyl ethyl ketone, stir evenly at high speed, then add pre-ultrasonic treated alumina, titanium dioxide, whitening agent, defoamer, etc., and stir for about 6 hours. Mixed into a highly thermally conductive white adhesive composition.

[0064] The composition was coated on the surface of a high thermal conductivity PI base film with a thickness of 25 μm by a coating machine, and the coating thickness was 25 μm, and then baked in an oven at 180° C. for 2 minutes to obtain a white adhesive layer.

[0065] Then a high thermal conductivity epoxy resin adhesive composition with a thickness of 25 μm was coated on the surface of the high thermal conductivity white adhesive ...

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Abstract

The invention relates to a high-heat-conductivity white adhesive composition, a high-heat-conductivity white cover film made from the same and a preparation method thereof. The high-heat-conductivity white adhesive composition comprises flexible saturated polyester, hard saturated polyester, blocked isocyanate curing agent, pigment, high-heat-conductivity filler, fluorescent brightener, defoaming agent and solvent. The high-heat-conductivity white cover film comprises a high-heat-conductivity insulation basal film, a high-heat-conductivity white adhesive composition coating applied onto one side of the high-heat-conductivity insulation basal film, and a high-heat-conductivity insulation adhesive layer applied onto the other side of the high-heat-conductivity insulation basal film. By applying the heat-conduction adhesive layers onto the two sides of the high-heat-conductivity insulation basal film, the high-heat-conductivity white cover film has the advantages of high whiteness and high reflectivity of the cover film surface, low cost, favorable yellowing resistance, excellent folding resistance and high heat conductivity, and can be widely used in the fields of high-power LEDs (Light Emitting Diodes), backlight sources and the like.

Description

technical field [0001] The invention relates to the field of flexible printed circuits, in particular to a highly thermally conductive white adhesive composition used for flexible printed circuits, a high thermally conductive white cover film prepared using the composition and a manufacturing method thereof. Background technique [0002] The progress of the information and communication industry has led to the rapid development of the microelectronics industry. Flexible printed circuits (FPC) have emerged and developed rapidly, and have been widely used in many fields such as mobile phones, notebook computers, and liquid crystal displays. The biggest difference between a flexible printed circuit board (FPCB) and a rigid printed circuit board (PCB) is that the former uses a cover film. The function of the cover film exceeds that of the solder resist ink for PCB. Oxidation of the circuit prevents FPC from being corroded by dust, moisture and chemicals, and can reduce the influ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06C09J7/02B32B27/08H05K1/02
Inventor 鹿海华茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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