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Irreversible bonding method using polydimethylsiloxane as substrate material

A polydimethylsiloxane and bonding technology, which is applied in the field of microfluidic chips, can solve the problems of high equipment requirements, narrow bonding range, low bonding strength, etc., and achieve simple processing technology and synthetic bonding Low cost and high bonding strength

Inactive Publication Date: 2012-09-26
JIANGSU FEIYA CHEM IND +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1) The method of using oxygen plasma to treat the bonding surface has relatively high requirements for equipment and relatively high bonding costs. At the same time, due to the limitations of the equipment itself, the processed PDMS chip cannot be bonded in the first time. Combined strength has a certain influence;
[0008] 2) The national invention patent with publication number CN1683443A, this method does not require specific equipment, and the bonding cost is low, but the bonding range is narrow, the bonding strength is low, and the bonding efficiency is low;

Method used

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  • Irreversible bonding method using polydimethylsiloxane as substrate material
  • Irreversible bonding method using polydimethylsiloxane as substrate material
  • Irreversible bonding method using polydimethylsiloxane as substrate material

Examples

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Effect test

Embodiment 1

[0028] refer to Figure 1-Figure 5 , this embodiment is an irreversible bonding method using PDMS as the bonding component material and using PDMS as the base component material, which specifically includes the following steps:

[0029] Step 1: Put the PDMS bonded component 2 in analytically pure acetone for ultrasonic cleaning, and dry it. For bonded component 2, refer to figure 1 ;

[0030] Step 2: ultrasonically clean the PDMS bonding assembly 2 in analytically pure isopropanol, and blow dry;

[0031] Step 3: Place the PDMS substrate assembly 3 in analytically pure ethanol for ultrasonic cleaning, rinse with deionized water, and dry it. For substrate assembly 3, refer to figure 2 ;

[0032] Step 4: Bake the PDMS bonding assembly 2 and the base assembly 3 in an oven at 80 degrees for 10 minutes;

[0033] Step 5: Treat the bonded surfaces of PDMS bonding component 2 and base component 3 for 20 seconds at the highest intensity of the corona discharge apparatus model BD-20...

Embodiment 2

[0036] This embodiment is an irreversible bonding method using PDMS as the bonding component material and PMMA as the base component material, which specifically includes the following steps:

[0037] Step 1: ultrasonically clean the PDMS bonded components in analytically pure acetone, and blow dry;

[0038] Step 2: ultrasonically clean the PDMS bonded components in isopropanol of analytical grade, and blow dry;

[0039] Step 3: ultrasonically clean the PMMA substrate assembly in analytically pure ethanol, rinse with deionized water, and dry;

[0040] Step 4: Bake the PDMS bonded assembly and the PMMA substrate assembly in an oven at 100 degrees for 8 minutes;

[0041] Step 5: Treat the bonding surfaces of the PDMS bonding component and the substrate component separately with a corona discharge apparatus;

[0042] Step 6: Bond the PDMS bonded component and the PMMA substrate component directly. In order to increase the bonding strength between the PDMS bonded component and t...

Embodiment 3

[0044] This embodiment is an irreversible bonding method using PDMS as the bonding component material and silicon wafer as the base component material, which specifically includes the following steps:

[0045] Step 1: ultrasonically clean the PDMS bonded components in analytically pure acetone, and blow dry;

[0046] Step 2: ultrasonically clean the PDMS bonded components in isopropanol of analytical grade, and blow dry;

[0047] Step 3: ultrasonically clean the silicon wafer substrate assembly in analytically pure ethanol, rinse with deionized water, and dry;

[0048] Step 4: Bake the PDMS bonding assembly and the substrate assembly in an oven at 120 degrees for 5 minutes;

[0049] Step 5: Treat the bonding surfaces of the PDMS bonding component and the substrate component separately with a corona discharge apparatus;

[0050] Step 6: Directly bond the PDMS bonding component and the silicon wafer substrate component, so far, the bonding is completed.

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Abstract

The invention discloses an irreversible bonding method using polydimethylsiloxane (PDMS) as a substrate material, belonging to the field of microfluidic chips. The method comprises the following steps of: ultrasonically cleaning PDMS bonding assembly in acetone and isopropanol sequentially, and cleaning a substrate assembly in alcohol and deionized water; after the PDMS bonding assembly and the substrate assembly are dried in a drying oven, respectively treating the faying surfaces of the PDMS bonding assembly and the substrate assembly by using a corona discharger, and directly faying the PDMS bonding assembly and the substrate assembly immediately to complete bonding. In order to enhance faying strength, a cover plate assembly can be also added during faying and is clamped by using a clamp. The invention has the advantages of no need of expensive equipment such as oxygen plasma treatment equipment and the like, low bonding cost, simple machining process, high yield, high cost performance and high bonding strength; and the selected substrate materials are extensive, are not limited to PDMS and can be silicon wafers, quartz, glass or PMMA (Polymethyl Methacrylate).

Description

[0001] Field: [0002] The invention relates to an irreversible bonding method using polydimethylsiloxane as a substrate, and belongs to the field of microfluidic chips. Background technique: [0003] Microfluidic chip, also known as microfluidic chip laboratory, refers to a chemical or biological laboratory built on a chip of a few square centimeters. It integrates the basic operation units involved in the fields of chemistry and biology such as sample preparation, reaction, separation, detection, cell culture, sorting, lysis, etc. into a small chip, and forms a network of microchannels to control fluid flow. Throughout the system, it is used to realize various functions of conventional chemical or biological laboratories. [0004] Polydimethylsiloxane (PDMS) is an elastic high molecular polymer, usually it is mixed and polymerized by PDMS prepolymer and curing agent according to a certain volume ratio (mass ratio). PDMS has very ideal material properties: good insulation, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/12C08L83/04
Inventor 常洪龙丁继亮张峰陈方璐郝思聪苑伟政
Owner JIANGSU FEIYA CHEM IND