Method for cutting water/oxygen-sensitive rare-earth halide crystal

A water-oxygen-sensitive cutting method technology, which is applied in the cutting field of water-oxygen-sensitive rare earth halide crystals, and can solve the problems of water-oxygen-sensitive rare earth halide crystals being prone to deliquescence and other problems

Inactive Publication Date: 2011-08-03
FUJIAN CASTECH CRYSTALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that water and oxygen sensitive rare earth halide crystals are easy to deliquescence during cutting, and the joint protection of the crystal surface protection layer and the water and oxygen barrier protective oil during the cutting process is designed. Wire cutting machine with non-diamond-coated stainless steel cutting wire, which realizes continuous cutting of water and oxygen sensitive crystals

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Example 1: 1 inch 5at% Ce doped LaBr 3 crystal cutting

[0014] Using domestic multi-wire cutting machine, doped LaBr in 5at% Ce 3 Apply a Vaseline protective layer on the surface of the crystal, and use the high-speed reciprocating motion of the stainless steel cutting wire and cutting mud to realize LaBr 3 Cutting of crystals in water and oxygen. Specific steps are as follows:

[0015] (1) Apply a protective layer of Vaseline evenly on the surface of the crystal, with a thickness of about 0.8mm;

[0016] (2) Gently wipe off part of the vaseline with fine sandpaper, and use anaerobic glue to fix the crystal on the standard part;

[0017] (3) Evenly mix SiC and silicone oil as cutting mud;

[0018] (4) Adjust the wire cutting machine to be in a horizontal state, install the cutting wire on the winding wheel, and then adjust the cutting line on the winding wheel, tensioning wheel and guiding wheel to be on the same plane through the tensioning wheel and the guiding ...

Embodiment 2

[0023] Example 2: 1.5 inches 2at% Ce doped LaCl 3 crystal cutting

[0024] Using domestic multi-wire cutting machine, doped LaCl at 2at% Ce 3 Apply a Vaseline protective layer on the surface of the crystal, and use the high-speed reciprocating motion of the stainless steel cutting wire and cutting mud to realize LaCl 3 Cutting of crystals in water and oxygen. Specific steps are as follows:

[0025] (1) Apply a protective layer of Vaseline evenly on the surface of the crystal, with a thickness of about 0.5mm;

[0026] (2) Gently wipe off part of the vaseline with fine sandpaper, and use anaerobic glue to fix the crystal on the standard part;

[0027] (3) Combining SiC and Al 2 o 3 After being evenly mixed according to the weight ratio of 1:4, it is evenly mixed with kerosene as a cutting slurry, and the ratio of cutting abrasive to kerosene is 1:4;

[0028] (4) Adjust the wire cutting machine to be in a horizontal state, install the cutting wire on the winding wheel, and...

Embodiment 3

[0033] Example 3: 2 inches 2% Ce doped LaBr 3 crystal cutting

[0034] Using domestic multi-wire cutting machine, doped LaBr at 2at% Ce 3 The surface of the crystal is covered with a polyimide protective layer, and the high-speed reciprocating motion of the diamond-coated stainless steel cutting wire and the cutting mud is used to realize LaBr 3 Cutting of crystals in water and oxygen. Specific steps are as follows:

[0035] (1) The surface of the crystal is covered with a polyimide protective layer with a thickness of about 0.2mm;

[0036] (2) Remove part of the polyimide protective layer, and use anaerobic adhesive to fix the crystal on the standard part;

[0037] (3) Evenly mix CeO with protective cutting oil (kerosene and silicone oil mixed in equal volume) as cutting mud, and the ratio of cutting abrasive to protective cutting oil is 1:4;

[0038] (4) Adjust the wire cutting machine to be in a horizontal state, install the cutting wire on the winding wheel, and then ...

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Abstract

The invention relates to a method for cutting a water / oxygen-sensitive rare-earth halide crystal, which adopts a wire cutting method and comprises the following steps: using hydrophobic protective oil or polyimide to protect the crystal surface; mixing aluminum oxide, silicon carbide, cerium oxide or mixture thereof with protective cutting oil in a certain proportion to obtain cutting mud; and cutting the water / oxygen-sensitive rare-earth halide crystal by using a wire cutting machine. In the invention, the crystal surface protective layer and the water / oxygen-proof protective oil in the cutting process are designed for common protection, and the wire cutting machine provided with a stainless steel cutting wire which is plated or not plated with diamonds, is adopted, thereby implementing continuous cutting of the water / oxygen-sensitive rare-earth halide crystal. The crystal cut by the method provided by the invention has the advantages of uniform thickness and no air slaking on the surface, and ensures the subsequent processing and utilization of the crystal.

Description

【Technical field】 [0001] The invention relates to a cutting method of a water-oxygen-sensitive rare earth halide crystal which is easily deliquescent and deteriorated in the air, and belongs to the field of crystal material processing. 【technical background】 [0002] Rare earth halide crystals are the new darling of the artificial crystal family, and are widely used in high-energy physics, nuclear physics, radiology, geological exploration, explosion-proof detection and other fields. The rare earth halide crystal involved in the present invention refers to doping with rare earth ions (such as Ce 3+ ) scintillation crystal, a large single crystal that emits ultraviolet, visible or infrared light under the irradiation of high-energy particles (X-rays or γ-rays). [0003] Cerium Doped Rare Earth Halides, Ce:LnX 3 (Ln=La, Lu, Gd, Y; X=Cl, Br, I), is a hot research area in recent years, because of its high light output efficiency, fast decay, very high energy resolution and low...

Claims

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Application Information

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IPC IPC(8): B28D5/04
Inventor 张志城陈伟吴少凡郑熠
Owner FUJIAN CASTECH CRYSTALS
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