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Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance

A lead-free solder, high-resistance technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problems of material brittleness, poor solid solubility of alloy components, poor solderability, etc. good electrical conductivity, improved oxidation resistance, and improved oxidation resistance

Inactive Publication Date: 2011-08-17
宁波喜汉锡焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, many current circuit boards and components cannot withstand high temperatures above 270°C, especially some electronic components that are more sensitive to temperature, so they have to continue to use the old tin-lead solder
[0006] In this regard, people have carried out various researches on low-temperature lead-free solders, and have also obtained substantial achievements and progress. Many new solders have been invented, but some shortcomings have also appeared in practice, such as the hardness of some materials. Too large; some materials are brittle and cannot be processed into the required shape and size; some are scarce in nature, expensive, and the proportion of mass production is not high; some alloy components have poor solid solubility, which is easy to cause segregation; Poor spot aging life; some have poor weldability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The metals that meet the standards of Bi, Zn, Al, Ge, Ga, and Sn are configured into an alloy amount of a certain weight unit by weight percentage, such as 1kg. Among them, 30gBi, 80gZn, 8gAl, 0.1gGe, 0.05gGa, and the rest are Sn. Put the materials into the vacuum induction melting furnace respectively, evacuate to a qualified vacuum, fill with argon, heat up to 600°C to start melting, melt and cast into ingots.

[0021] The composition of the above-mentioned lead-free solder sample is 3%Bi, 8%Zn, 0.8%Al, 0.01%Ge, 0.005%Ga, and the rest is Sn. The melting temperature (liquidus point) of this alloy was 195°C using a differential scanning calorimeter (DSC) for melting point testing.

Embodiment 2

[0023] The metals that meet the standards of Bi, Zn, Al, Ge, Ga, and Sn are configured into an alloy amount of a certain weight unit by weight percentage, such as 1kg. Among them, 10gBi, 100gZn, 0.1gAl, 0.05gGe, 0.05gGa, and the rest are Sn. Put the materials into the vacuum induction melting furnace respectively, evacuate to a qualified vacuum, fill with argon, heat up to 600°C to start melting, melt and cast into ingots.

[0024] The composition of the above-mentioned lead-free solder sample is 1%Bi, 10%Zn, 0.01%Al, 0.005%Ge, 0.005%Ga, and the rest is Sn.

[0025] Using a differential scanning calorimeter (DSC) for melting point testing, the melting temperature (liquidus point) of this alloy is 202°C

Embodiment 3

[0027] Using Bi, Zn, Al, Ge, Ga., Sn as raw materials, configure 1kg alloy amount by weight percentage, of which 40gBi, 40gZn, 3gAl, 1gGe, 0.01gGa and the rest are Sn. Put the alloy material into a vacuum induction melting furnace, pump out air, then fill it with argon, heat up to 600°C to start melting, melt it and cast it into an ingot.

[0028] The composition of the above-mentioned lead-free solder sample is 4% Bi, 4% Zn, 0.3% Al, 0.1% Ge, 0.001% Ga, and the rest is Sn.

[0029] The melting temperature (liquidus point) of this alloy was 214°C using a differential scanning calorimeter (DSC) for melting point testing.

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Abstract

A corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance contains Bi 1wt% to 4wt%, Zn 4wt% to 10wt%, Al 0.001 wt% to 1.0 wt%, Ge 0.001 wt% to 0.1 wt%, Ga 0.001 wt% to 0.1 wt% and the balance of Sn. The solder alloy has a melting point of 195 to 215 DEG C, and has high mechanical strength, excellent creep resistance, good wettability and high corrosion resistance. In addition, the solder alloy can effectively suppress the surface oxidation of Zn, and has good manufacturability and solder joint reliability.

Description

technical field [0001] The invention relates to soldering materials, in particular to a lead-free solder suitable for electronic assembly soldering. Background technique [0002] The use of solder has a history of thousands of years, and the traditional tin-lead solder has been widely used in recent hundreds of years due to its excellent performance and low cost. Before the introduction of lead-free solder, It has always been the main welding material in electronic assembly welding. [0003] With the advancement of science and technology and the improvement of people's awareness of environmental protection, the hazards of lead and its compounds to human health and pollution to the environment are increasingly recognized by people. The promulgation of ROSH and other related lead prohibition laws is equivalent to declaring that lead-free solder has officially become the mainstream of the times. It has become a major trend in the global microelectronics manufacturing field to ...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 朱岳恩丁建设
Owner 宁波喜汉锡焊料有限公司
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