Method of preparing patterned BiFeO3 film on surface of functional Si substrate
A substrate surface and patterning technology, applied in the direction of spin-exchange coupled multilayer film, substrate/intermediate layer, magnetic film to substrate, etc., achieves the effect of simple preparation process, clear edge outline, and broad application prospects
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Embodiment 1
[0029] (1) Select (111) Si substrate as the substrate, place the cut Si substrate in commercially available detergent, acetone, and ethanol for ultrasonic cleaning for 10 min each to remove impurities such as grease on the surface of the Si substrate; After cleaning, rinse the substrate with a large amount of distilled water, and finally dry it with nitrogen. Place the clean Si substrate in a UV irradiator for 20 minutes to make the surface of the substrate reach "atomic cleanliness".
[0030] (2) Rapidly immerse the Si substrate irradiated by ultraviolet light into a newly prepared 1vol% octadecyltrichlorosilane (OTS)-toluene solution, and soak it for 30 minutes at room temperature to form a layer on the surface of the substrate OTS monomolecular film; after soaking, clean the Si substrate in acetone for 2 minutes, and then place it at 120°C for 5 minutes to remove residual organic matter and promote the chemical adsorption of OTS-SAMs. Then, the OTS-SAMs matrix is covered...
Embodiment 2
[0038] (1) Select (111) Si substrate as the substrate, place the cut Si substrate in commercially available detergent, acetone, and ethanol for ultrasonic cleaning for 10 min each to remove impurities such as grease on the surface of the Si substrate; After cleaning, rinse the substrate with a large amount of distilled water, and finally dry it with nitrogen. Place the clean Si substrate in a UV irradiator and irradiate it for 10 minutes to make the surface of the substrate reach "atomic cleanliness".
[0039] (2) Rapidly immerse the Si substrate irradiated by ultraviolet light into a newly prepared 1vol% octadecyltrichlorosilane (OTS)-toluene solution, and soak it for 20 minutes at room temperature to form a layer on the surface of the substrate OTS monomolecular film; after soaking, the Si substrate was cleaned in acetone for 3 minutes, and then placed at 110°C for 3 minutes to remove residual organic matter and promote chemical adsorption of OTS-SAMs. Then, the OTS-SAMs ma...
Embodiment 3
[0044] (1) Select (111) Si substrate as the substrate, place the cut Si substrate in commercially available detergent, acetone, and ethanol for ultrasonic cleaning for 10 min each to remove impurities such as grease on the surface of the Si substrate; After cleaning, rinse the substrate with a large amount of distilled water, and finally dry it with nitrogen. Place the clean Si substrate in a UV irradiator and irradiate it for 15 minutes to make the surface of the substrate reach "atomic cleanliness".
[0045] (2) Rapidly immerse the Si substrate irradiated by ultraviolet light into a newly prepared 1vol% octadecyltrichlorosilane (OTS)-toluene solution, and soak it for 40 minutes at room temperature to form a layer on the surface of the substrate OTS monomolecular film; after soaking, the Si substrate was cleaned in acetone for 3 minutes, and then placed at 130°C for 4 minutes to remove residual organic matter and promote chemical adsorption of OTS-SAMs. Then, the OTS-SAMs ma...
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