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Treatment solution for reducing oxidation films on surface of copper and copper alloys and treatment method thereof

A technology of surface oxidation and treatment method, applied in the direction of metal material coating process, etc., can solve problems such as affecting the health of operators and harming the water treatment system by copper ions, achieving good market application prospects, excellent reduction effect, and fast treatment speed. Effect

Active Publication Date: 2011-09-21
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that a large amount of acid mist is generated when nitric acid, sulfuric acid, hydrogen peroxide and other solutions are used to clean and remove the oxide film formed on the surface of copper and copper alloy products, which seriously affects the health of operators, and the solution after cleaning contains The problem that a large amount of copper ions are harmful to the water treatment system provides a treatment solution for reducing the oxide film on the surface of copper and copper alloys and its use method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Processed sample: Spray gun made of copper alloy welded with acetylene

[0034]Treatment solution: the solvent is water, the reducing agent is ascorbic acid and glucose, sodium dodecylbenzenesulfonate is also included as a surfactant, boric acid is used as a buffer, thioethylene glycol and 8-hydroxyquinoline are used as a stabilizer, and the reduction The agent concentration is 40g / l, the surfactant concentration is 0.1g / l, the buffer concentration is 3g / l, the stabilizer concentration is 0.6g / l, and the pH value is 2-3.

[0035] Use the above-mentioned treatment solution to treat the spray gun made of copper alloy welded by acetylene, and the specific treatment method is as follows:

[0036] (1) Configuration of the treatment solution: add 1g sodium dodecylbenzenesulfonate and 30g boric acid in 700 milliliters of water, heat and stir until it dissolves; add 200g ascorbic acid and 200g glucose after cooling, then add 5g thioethylene glycol and 1g of 8-hydroxyquinoline;...

Embodiment 2

[0042] Processed sample: Spray gun made of copper alloy welded with acetylene

[0043] Treatment liquid: the solvent is water, the reducing agent is phenylhydrazine and glucose, sodium lauryl sulfate is also included as a surfactant, potassium dihydrogen phosphate is used as a buffer, αα'-bipyridine is used as a stabilizer, and the reducing agent concentration is 40g / l, the surfactant concentration is 0.1g / l, the buffer concentration is 5g / l, the stabilizer concentration is 0.1g / l, and the pH value is 10-12.

[0044] Use the above-mentioned treatment solution to treat the spray gun made of copper alloy welded by acetylene, and the specific treatment method is as follows:

[0045] (1) The configuration of the treatment solution: add 1g of sodium lauryl sulfate to 700ml of water, heat and stir until it dissolves; add 200g of phenylhydrazine and 200g of glucose after cooling, then add 1g of αα'-bipyridine; add water to make up to 1 liter , to obtain a concentrated solution; 1 l...

Embodiment 3

[0051] Processed sample: Spray gun made of copper alloy welded with acetylene

[0052] Treatment liquid: the solvent is water, the reducing agent is N,N-diethylhydroxylamine and ascorbic acid, also includes fatty alcohol polyoxyethylene ether as surfactant, boric acid as buffer, thiourea and 2-mercaptobenzothiazole as stabilizer agent, the reducing agent concentration is 40g / l, the surfactant concentration is 5g / l, the buffering agent concentration is 5g / l, the stabilizing agent concentration is 0.02g / l, and the pH value is 3-4.

[0053] Use the above-mentioned treatment solution to treat the spray gun made of copper alloy welded by acetylene, and the specific treatment method is as follows:

[0054] (1) Configuration of the treatment solution: add 50g of fatty alcohol polyoxyethylene ether into 700ml of water, heat and stir until it dissolves; add 200g of N, N-diethylhydroxylamine and 200g of ascorbic acid after cooling, then add 0.1g of thiourea and 0.1 g 2-mercaptobenzothi...

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Abstract

The invention discloses a treatment solution for reducing the oxidation films on the surfaces of copper and copper alloys and a treatment method thereof. In the treatment solution, one or more of ascorbic acid, hypophosphite, glucose, hydrazine, hydrazine derivatives, hydroxylamine and hydroxylamine derivatives are used as reducing agents to reduce the oxygen element in the oxidation films formedon the surfaces of copper and copper alloys and keep the copper element. The treatment solution has the following advantages: the acid fog with a lot of H2, NO2 and the like can not generated in the reduction treatment to seriously influence the fitness of the operator; and after treatment, the copper ion content of the treatment solution is less than 0.5mg / l, thus the water treatment system can not be polluted; and the treatment solution is environmentally-friendly. In addition, the oxidation films formed on the surfaces of copper and copper alloys can be reduced to bright copper and copper alloys in only 1-5 minutes, thus the treatment solution is the treatment solution with low cost,, high treatment speed, remarkable effect and environmental friend and has good market application prospect, and the method is convenient to use.

Description

technical field [0001] The invention relates to the technical field of surface treatment of metal materials, in particular to a treatment solution for reducing oxide films on the surface of copper and copper alloys in a healthy and environment-friendly manner and a treatment method thereof. Background technique [0002] The processing volume of copper and copper alloy in China is about 10 million tons per year, and its annual output value is more than 600 billion yuan. Generally, after machining copper and copper alloy workpieces, before further passivation or plating protection treatment, the surface needs to be cleaned to remove the oxide film formed on the surface. At present, copper and copper alloy products are mainly cleaned by nitric acid, sulfuric acid, hydrogen peroxide and other treatment liquids or their mixtures. These treatment liquids will produce a large amount of H 2 , NO 2 The acid mist, etc., seriously affects the health of operators, and copper and coppe...

Claims

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Application Information

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IPC IPC(8): C23C22/52C23C22/07C23C22/63C23C22/68
Inventor 曾志翔乌学东赵文杰张颖鑫薛群基
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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