Production process for electroplated abrasive material on surface of metal wire

Abstract

The invention relates to a production process for electroplated abrasive material on the surfaces of a metal wire. The production process comprises the following steps: 1. carrying out chemical nickel plating treatment on the surface of a diamond; 2. preparing impactive nickel electroplating solution; 3. preparing sulfamic acid nickel plating solution and nickel-plated diamond mixed electroplating solution; 4. cleaning; 5. carrying out impactive nickel electroplating; 6. electroplating the nickel-plated diamond on the surface of the metal wire; 7. reinforcing nickel-plated diamond granules; and 8. carrying out post-electroplating treatment. The invention employs the diamond and the metal wire the surfaces of which are chemically nickel-plated as raw materials, and realizes high-speed production by using sulfamic acid nickel plating solution. The binding of the nickel-plated diamond and a nickel plating layer is identical nickel-material binding, and belongs to identical nickel-metal atomic force binding, so that the diamond has high firmness, long service life and high sawing capability.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a production process of electroplating abrasives on the surface of metal wires. Background technique [0002] With the development of the times, the strategy of energy saving and environmental protection is the common goal of the whole world, such as solar power generation industry (crystalline silicon is the main raw material) and LED optoelectronic industry (sapphire is the key raw material) are most obvious, but in cutting silicon materials and For sapphire materials, the traditional methods are mostly diamond band saw cutting or diamond inner circular saw cutting and steel wire driving silicon carbide mortar cutting fluid for cutting. The kerf cut by the diamond band saw is large and the product surface tolerance after cutting is very large, which is not suitable for precision cutting; the cutting efficiency of the diamond internal circular saw is low, the kerf is larg...

AI Technical Summary

Problems solved by technology

[0005] Due to the limitation of equipment and production process, the production efficiency is low; due to the limitation of equipment and production process, the diamond plating on the surface of the metal wire is unevenly distributed, resulting in excessive tolerance of wire diameter, which eventually leads to large cutting loss and loss of the cut product. The surface thickness of the product after cutting is inconsistent or out of tolerance; the diamond and the metal deposition layer are mechanically combined, and the bonding force is insufficient; the coated metal layer on the diamond surface and the metal deposition layer on the wire surface are combined with different metal materials, the bonding force is insufficient; Acting as a cutting edge) the number of consolidation is insufficient, resulting in insufficient cutting edge and insufficient cutting ability; when the wire is energized with too much current and absorbs enough diamonds, the wire is prone to "electric burning fatigue" and is easily brittle; The bonding strength between the metal deposition layer a