Heat-conducting thermosetting molding composite material and application thereof

Abstract

The invention discloses a heat-conducting thermosetting molding composite material and application thereof. The heat-conducting thermosetting molding composite material comprises the following basic components in percentage by weight: (1) 15-65% of thermosetting matrix resin; (2) 20-80% of heat-conducting filler with a thermal conductivity greater than 1 W/m.DEG C; and (3) other additives, such as a toughening agent, an enhancer, a stabilizer and the like. The invention also discloses application of the heat-conducting thermosetting molding composite material in manufacturing LED (light emitting diode) lighting heat-radiation components. The molding temperature of the composite material can be controlled to below 220 DEG C that is the general soldering operation temperature, so that the assembly process of an LED lamp and a heat radiator and the molding process of a thermosetting material heat radiator can be integrated, and the substrate surface or heat-conducting metal support of the LED lamp can be directly connected with the heat-conducting material; and the molding die of the composite material and auxiliary systems thereof have the characteristics of effective heat insulation and temperature control and easy cleaning, and can effectively lower the processing and manufacturing cost of the LED lamp and improve the heat radiation capability of the LED heat radiator, thereby reducing the operating temperature of LED devices.

Description

technical field [0001] The present invention relates to a heat-conducting thermosetting molding composite material; in addition, the present invention also relates to using the heat-conducting thermosetting composite material to prepare a heat sink for an LED lighting device, especially a technical process capable of integrating an LED chip assembly and a heat sink. The obtained heat sink can effectively reduce the processing and manufacturing costs of the LED lighting device, improve the heat dissipation capacity of the LED heat sink, and thereby reduce the operating temperature of the LED device. Background technique [0002] LED (Light Emitting Diode) element is a type of semiconductor p-n junction structure element, which has low power consumption, long life, and anti-vibration characteristics. Recently, it has been used in fields such as display elements and light sources, especially general lighting devices, and has great commercial value. [0003] However, due to the...

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Problems solved by technology

[0006] (1) Casting and extruding metal aluminum heat sink: it can be used in the application of high-power LED lamps, and has the advantage of relatively mature technology, but the single molding cycle is relatively long, and subsequent secondary processing technology is required to achieve higher Good surface and appearance quality. At the same time, due to the inherent conductive properties of metal, products with small volume and high voltage such as LED lamps have mutual constraints on heat dissipation, safety, and appearance dimensions, resulting in relatively complicated electrical insulation design. It has the disadvantages of high production cost, low efficiency, and insufficient design flexibility

In order to solve the safety problem, it is usually required to use an isolated power supply as the power drive, but it will cause the volume of the entire lamp to be too large, which will affect the use and even the requirements of some regulations, such as IEC60061-1

[0007] Another solution is to use a non-isolated power supply to fully insulate the power circuit and the metal heat sink / lamp cup. However, since the insulation thickness of the LED substrate itself is only about 50um, a layer is required between the LED substrate and the metal fixture. The insulating layer is used to completely isolate the LED substrate and the metal heat sink, but it causes the heat dissipation inside the LED to be blocked, and the heat dissipation efficiency is reduced. At the same time, there is still a risk of safety hazards caused by direct contact between the LED power supply wire and the metal

[0008] (2) Heat sink made of thermoplastic material: it has the characteristics of flexible design, high molding efficiency, and easy realization of safety design, but due to the low thermal conductivity of thermoplastic materials, such as nylon and PBT, it is usually less than 0.2W / m.℃, so it can only be used in low-power LED lighting occasions, such as the power of LED lamps is lower than 1W, etc. For high-power applications, due to poor heat dissipation, there are high limitations

Even if some insulating plastics with high thermal conductivity are used, since the thermoforming temperature of such thermoplastic materials is usually higher than 250°C, the existing process uses a two-step process to connect the LED chip and its aluminum substrate to the metal bracket, thereby reducing Production efficiency, etc.

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