Method for preparing submicron polycrystalline diamond abrasive with narrow particle size distribution

A polycrystalline diamond, sub-micron technology, applied in chemical instruments and methods, other chemical processes, etc., can solve problems such as workpiece scratches and unfavorable processing, and achieve the effects of short production cycle, enlarged production scale, and regular particle shape.

Active Publication Date: 2011-11-23
盘锦国瑞升科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally speaking, if you want to increase the grinding force, you must increase the particle size of the abrasive, but the disadvantage of inc

Method used

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  • Method for preparing submicron polycrystalline diamond abrasive with narrow particle size distribution
  • Method for preparing submicron polycrystalline diamond abrasive with narrow particle size distribution
  • Method for preparing submicron polycrystalline diamond abrasive with narrow particle size distribution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Take 2 kg of semi-finished unshaped unclassified polycrystalline diamond micropowder with an original particle size of um and disperse it in 10 kg of pure water. Add 10 ml of concentrated ammonia water and 10 g of sodium hexametaphosphate, and stir and disperse for 30 minutes. Add the dispersed slurry into the planetary ball mill tank, add 16kg of 5mm steel balls, start the ball mill to start shaping, and run for 12h at 400rpm. Discharging drying, pickling to remove metal impurities, cleaning to PH=6. The pickled and purified diamond is ultrasonically dispersed in pure water at a concentration of 1% to 10%, and centrifuged at 800 rpm for 10 minutes for centrifugal classification. The lower part is taken and the particle size is tested with the laser particle size analyzer MICROTRAC S35OO. The particle size distribution diagram is shown figure 1 . The morphology of the particles was tested with a scanning electron microscope, and the results are as follows figure 2 . I...

Embodiment 2

[0037] Take 15 kg of semi-finished unshaped and unclassified polycrystalline diamond powder with an original particle size of um and disperse it in 60 kg of pure water, add 100 ml of triethanolamine, and stir and disperse for 30 min. Add 10kg of steel balls with a diameter of 2mm into the main cavity of the ultra-fine mill, add the dispersed slurry into the barrel, start the ultra-fine mill to begin crushing and shaping, and run at 800 rpm for 8 hours. Discharging drying, pickling to remove metal impurities, cleaning to PH=6. The pickled and purified diamond is ultrasonically dispersed in pure water at a concentration of 1% to 10%, centrifuged at a centrifugal speed of 800 rpm for 10 minutes, and the upper material is taken. Then the top material is centrifuged and classified at a centrifugal speed of 2000 rpm for 30 minutes, and the bottom material is taken. Use the laser particle size analyzer MICROTRAC S35OO to test its particle size, see the particle size distribution diag...

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Abstract

The invention relates to a method for preparing submicron polycrystalline diamond abrasive with narrow particle size distribution, which comprises the following steps: (1) preparing pulp; (2) reshaping; and (3) centrifugally grading. In the invention, a submicron diamond product can be prepared by reshaping polycrystalline diamond powder of a particle size of 0.5 to 10 micrometer in a planet mill, superfine mill or supersonic pneumatic mill and grading in a high-speed centrifugal machine, wherein the particle sizes of the product may be 0.125 micrometer, 0.25 micrometer, 0.5 micrometer, 0.75 micrometer, 1 micrometer and 1.5 micrometers. The performance of the product is represented by the narrow particle size distribution of the product and regular particle shape. The product of the method is very suitable for fine polishing of sapphire, precision ceramics, optical crystals and metal molds; and after a sapphire wafer for an LED substrate is polished by the 0.5-micrometer diamond prepared by the method, the surface roughness of the sapphire wafer is 2.81 nanometers. The method is short in production period and is convenient for enlarging production scale.

Description

Technical field [0001] The invention relates to a preparation process of diamond fine powder, in particular to a method for shaping polycrystalline diamond fine powder of submicron size. Background technique [0002] Diamond is known as the hardest material in the world. Its high hardness gives it high grinding power. Therefore, as a highly efficient abrasive, diamond plays an important role in the field of grinding and polishing. Diamond is especially suitable for the surface precision machining of sapphire crystals, superhard ceramics and metals, and optical crystals. [0003] Generally speaking, if you want to increase the grinding force, you must increase the particle size of the abrasive, but the disadvantage of increasing the particle size is that it will produce deeper scratches on the surface of the workpiece, which is not conducive to the next step of processing. And a kind of polycrystalline diamond (Detonation Polycrystalline Diamond, PCD for short, also called polycrys...

Claims

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Application Information

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IPC IPC(8): C09K3/14
Inventor 胡晓刚陈晨葛丙恒
Owner 盘锦国瑞升科技有限公司
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