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Process for manufacturing tungsten spin-coated sputtering tube target

A production process and tube target technology, which is applied in the field of sputtering tube target production process, can solve the problems of inability to meet the new requirements of specific impedance and film stress, decrease of film uniformity and wiring quality, poor target compactness, etc., to achieve Good compactness, improved uniformity and wiring quality, and high yield

Active Publication Date: 2012-12-12
LUOYANG KEWEI MOLYBDENUM & TUNGSTEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the main preparation method of foreign tungsten spin coating sputtering tube target is to use extrusion or drawing forming process to process and shape, and finally heat treatment, machining and back plate to form the tungsten sputtering tube target. The equipment requirements are high, the process is complicated, the cost is high, and the prepared target has poor density and large grain size. When using this product for coating, the uniformity of the film and the quality of wiring are greatly reduced, so it cannot meet the needs of solar photovoltaic products. New Requirements for Specific Impedance and Membrane Stress of Materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A manufacturing process of a sputtering tube target for tungsten spin coating, using tungsten powder as raw material, tungsten powder

[0027] The purity is ≥99.95%, the particle size is 2.6μm, and the hardness is HV200. The production steps are as follows:

[0028] Step 1. Put the raw materials into the rubber mold sleeve to prepare a hollow powdery tungsten tube blank, and then use a cold isostatic press to form it with a pressure of 50Mpa. After 20 minutes, the solid tube blank is formed;

[0029] Step 2. Put the formed solid tube billet into the intermediate frequency sintering furnace, and put hydrogen into the furnace.

[0030] Ensure that the tube blank is heated in a hydrogen atmosphere. The heating temperature is 1900°C and the heating time is 30 hours. After that, the water cycle is used to cool down, and it is cooled to room temperature after 8 hours. The formed blank is ready for use:

[0031] Step 3: Heat the formed green body processed in step 2 to 1300°C...

Embodiment 2

[0035] A manufacturing process of a sputtering tube target for tungsten spin coating, using tungsten powder as raw material, tungsten powder

[0036] The purity is ≥99.95%, the particle size is 3μm, and the hardness is HV215. The production steps are as follows:

[0037] Step 1. Put the raw materials into the rubber mold sleeve to prepare a hollow powdery tungsten tube blank, and then use a cold isostatic press to form it with a pressure of 200Mpa. After 15 minutes, the solid tube blank is formed;

[0038] Step 2. Put the formed solid tube billet into the intermediate frequency sintering furnace, and put hydrogen into the furnace.

[0039] Ensure that the tube blank is heated in a hydrogen atmosphere. The heating temperature is 1900°C and the heating time is 30 hours. After that, the water cycle is used to cool down. After 10 hours, it is cooled to room temperature and completed. The formed blank is ready for use:

[0040] Step 3: Heat the formed green body processed in step ...

Embodiment 3

[0044] A manufacturing process of a sputtering tube target for tungsten spin coating, using tungsten powder as raw material, tungsten powder

[0045] The purity is ≥99.95%, the particle size is 3.3μm, and the hardness is HV235. The production steps are as follows:

[0046] Step 1. Put the raw materials into the rubber mold sleeve to prepare a hollow powdery tungsten tube blank, and then use a cold isostatic press to form it with a pressure of 400Mpa. After 10 minutes, the solid tube blank is formed;

[0047] Step 2. Put the formed solid tube billet into the intermediate frequency sintering furnace, and put hydrogen into the furnace.

[0048] Ensure that the tube blank is heated in a hydrogen atmosphere. The heating temperature is 1900°C and the heating time is 30 hours. After that, the water cycle is used to cool down. After 16 hours, it is cooled to room temperature and completed. The formed blank is ready for use:

[0049] Step 3: Heat the formed green body processed in Ste...

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Abstract

The invention discloses a process for manufacturing a tungsten spin-coated sputtering tube target. The process uses tungsten as a raw material, and comprises the following steps: filling a raw material into a rubber mold sleeve and preparing a hollow powder tungsten tube blank; forming in a cold isostatic press, placing a formed solid tube blank into a medium-frequency sintering furnace and keeping the formed blank body for later use; heating the formed blank to 1,300 to 1,700 DEG C for 1 to 3 hours, taking the blank out, and forging the blank with an air hammer till a tungsten rod is formed;boring, lathing an external circle and regulating the roughness of the surface to Ra1.6 to Ra3.2mu M; and thus, manufacturing the sputtering target tube. In the method, the simple manufacturing process with low equipment requirement ensures low cost, the prepared target is desirable in compactness and the relative density of the prepare target reaches over 99 percent.

Description

technical field [0001] The invention relates to a manufacturing process of a sputtering tube target, in particular to a manufacturing process of a tungsten rotary coating sputtering tube target. Background technique [0002] The tungsten rotary coating sputtering tube target is mainly used for the coating of photovoltaic element substrates. The physical properties of this type of product itself directly affect the performance of the coating. , when the less dense sputtering target is bombarded, the gas in the pores inside the target is suddenly released, causing large-sized target particles or particles to splash, or the particles caused by the secondary electron bombardment of the film after film formation Sputtering, the appearance of these particles will reduce the quality of the film. In order to reduce the pores in the solid target and improve the performance of the film, the sputtering target is generally required to have a higher density; The direction of the closes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34B22F3/16B22F3/24C22F1/18
Inventor 张灵杰
Owner LUOYANG KEWEI MOLYBDENUM & TUNGSTEN
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