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Method for preparing organic silicon modified thermal plastic phenolic resin

A phenolic resin and thermoplastic technology, applied in the field of preparation of modified thermoplastic phenolic resin, can solve the problems such as the difficulty of uniform dispersion of carbon fibers, and achieve the effect of improving friction and low cost

Inactive Publication Date: 2012-11-07
黄石理工学院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dispersion of carbon fiber in the process of preparing carbon fiber / boron modified phenolic resin composite material is difficult to be uniform.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] First mix 1.0mol of phenol and 0.2mol of formaldehyde, stir for 0.5h, when heated to 40°C, add 0.001mol of tetraethyl orthosilicate and 0.0001mol of hydrochloric acid; then raise the temperature to 80°C, keep it warm for 0.2h, and add hydrogen Sodium oxide adjusts the pH value of the reactant to 6.0 to obtain the product; the product is vacuum-dried at 100°C for 0.1h to obtain a silicone-modified thermoplastic phenolic resin, which contains 0.7% water and free phenol 2.0%, fluidity 35mm, curing speed 70 seconds, volatile matter 4%, softening point 95°C, particle size 200 mesh can reach 96%.

Embodiment 2

[0016] Mix 1.0mol of phenol and 2.0mol of formaldehyde, stir for 1 hour, and when heated to 60°C, add 0.3mol of tetraethyl orthosilicate and 0.005mol of acetic acid or sulfuric acid, use oil bath or water bath to heat, the heating rate is 5°C / Min, raise the temperature to 95°C, keep it warm for 2h, add potassium hydroxide to adjust the pH value of the reactant to 7.0, and obtain the product; put the product in a vacuum drying oven to dry, heat to 240°C, and keep for 5.0h. Silicone-modified thermoplastic phenolic resin was obtained. After testing, it contained 0.3% of water, 1.0% of free phenol, fluidity of 50mm, curing speed of 95 seconds, volatile content of 2.5%, softening point of 95°C, and particle size of 200 mesh. Reach 98%.

Embodiment 3

[0018] Mix 1.0 mol of phenol and 10 mol of formaldehyde, stir for 3 hours, and when heated to 50°C, add 0.05 mol of tetraethyl orthosilicate and 0.01mol of oxalic acid, heat with an oil bath at a rate of 5°C / min, and heat up to 100°C, use a vacuum pump to evacuate, keep warm for 12h, add ammonium hydroxide to adjust the pH value of the reactant to 6.8, and then obtain the product; put the product in a vacuum drying oven to dry, heat to 260°C, and keep for 2.0h. Silicone-modified thermoplastic phenolic resin was obtained. After testing, it contained 0.5% water, 1.5% free phenol, fluidity 35mm, curing speed 80 seconds, volatile matter 5%, softening point 90°C, and particle size 200 mesh. Reached 97%.

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Abstract

The invention relates to a method for preparing organic silicon modified thermal plastic phenolic resin, which comprises the following steps of: firstly, mixing phenol and formaldehyde according to the mole ratio of 1 / 0.2 to 10, stirring the materials for 0.5 to 5h, adding tetraethoxysilane and acid after the materials are heated to 40 to 60 DEG C, then, raising the temperature to 80 to 100 DEG C, preserving the temperature for 0.2 to 12h, adding alkali for regulating the pH value of reactants to 6 to 7.5, obtaining products, drying the products in vacuum at 100 to 260 DEG C for 0.1 to 5h andobtaining finished products. The method has the advantages that the raw material resources are wide, the cost is low, the relative content of the dihydricphenol and moisture is reduced in the modified plastic phenolic resin preparation process, the thermal stability and the mechanical property of the modified thermal plastic phenolic resin are improved to a certain degree, the prepared particles have small diameters, the molecular weight distribution is uniform, and the volatile components are few.

Description

technical field [0001] The invention belongs to a method for preparing modified thermoplastic phenolic resin, in particular to a method for preparing modified thermoplastic phenolic resin through organic silicon. Background technique [0002] Phenolic resin is the first resin discovered and industrially synthesized in the world. Its raw materials are easy to obtain, the cost is low, and the production process and equipment are simple. Because of its good thermal stability, high mechanical strength, flame retardant, low toxicity, low smoke, etc., it is widely used in friction materials, coatings, refractory materials, foam materials and other fields. Thermoplastic phenolic resin is favored by people because of its properties such as softening and reliquefaction as the temperature rises. With the development of science and technology, people have higher and higher requirements for the performance of thermoplastic phenolic resins. At the same time, the use of ordinary phenolic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/28C08G8/10C09K3/14
Inventor 左小华屈媛邓祥义
Owner 黄石理工学院