Microflow sensor

A flow sensor, miniature technology, applied in the field of MEMS devices, can solve the problems of high power consumption and long response time of flow sensors, and achieve the effect of light weight, high sensitivity and stable performance

Inactive Publication Date: 2012-03-07
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides two kinds of miniature flow sensors, which solve the problems of high power consumption, heat conduction in the substrate and long response time of the existing flow sensors

Method used

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Examples

Experimental program
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Embodiment 1

[0044] Example 1, such as figure 1 As shown, it includes a substrate 5, an insulation layer 4 and a heating body 2. The substrate 5 has a groove, and the surface of the groove is framed with two separate insulation layers 4, and the heating body 2 is sputtered on the insulation layer 4. , The two ends of the heating body 2 are sputtered with metal electrodes 1;

[0045] The material of the substrate 5 is polysilicon;

[0046] The material of the heat insulation layer 4 is silicon nitride, which is deposited on the substrate 5 by a chemical vapor deposition (LPCVD) process, with a thickness of 1 μm;

[0047] The heating body is nickel metal with a curved shape;

[0048] The metal electrode is formed by sputtering a Pt layer on the surface of the Ti adhesion layer and then sputtering an Au layer.

Embodiment 2

[0049] Example 2, such as figure 2 , image 3 As shown, it includes a substrate 5, an insulation layer 4, an insulation layer 3, and a heating body 2. The substrate 5 has a groove. The surface of the groove is framed with two separate insulation layers 4, and the surface of each insulation layer is covered with insulation. Layer 3, a heating body 2 is sputtered on the insulating layer 3, and metal electrodes 1 are sputtered on both ends of the heating body 2;

[0050] The material of the substrate 5 is monocrystalline silicon;

[0051] The material of the heat insulation layer 4 is silicon nitride with a thickness of 1 μm;

[0052] The material of the insulating layer 3 is silicon dioxide with a thickness of 250 nm;

[0053] The heating body is nickel metal with a curved shape;

[0054] The metal electrode is composed of Au layer sputtered on the surface of the Ti adhesion layer.

[0055] The preparation method of this embodiment includes the following steps in sequence:

[0056] (1) As...

Embodiment 3

[0060] Example 3, such as figure 2 , image 3 As shown, it includes a substrate 5, an insulation layer 4, an insulation layer 3, and a heating body 2. The substrate 5 has a groove. The surface of the groove is framed with two separate insulation layers 4, and the surface of each insulation layer is covered with insulation. Layer 3, a heating body 2 is sputtered on the insulating layer 3, and metal electrodes 1 are sputtered on both ends of the heating body 2;

[0061] The material of the substrate 5 is glass;

[0062] The material of the heat insulation layer 4 is silicon nitride with a thickness of 1 μm;

[0063] The material of the insulating layer 3 is silicon dioxide with a thickness of 250 nm;

[0064] The heating body 2 is Pt metal with a curved shape;

[0065] The metal electrode 1 is composed of an Al layer sputtered on the surface of the Ti adhesion layer;

[0066] The preparation method of this embodiment includes the following steps in sequence:

[0067] (1) As shown in Figur...

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Abstract

A microflow sensor, which belongs to an MEMS (micro-electromechanical system) device, is used for air flow measurement, and solves the problems of conventional flow sensors, i.e. high power consumption, heat conduction of substrates and long response time. A substrate of one type of microflow sensor is provided with sockets, two separated heat-insulating layers are erected on the surfaces of the sockets, a heating body is sputtered on each heat-insulating layer, and metal electrodes are sputtered on both ends of each heating body. A substrate of another type of microflow sensor is provided with sockets, two separated heat-insulating layers are erected on the surfaces of the sockets, the surface of each heat-insulating layer is covered by an insulating layer, heating bodies are sputtered on the insulating layers, and metal electrodes are sputtered on both ends of each heating body. The microflow sensor is small and light, has stable performance, can effectively reduce measurement errors caused by the heat conduction of the substrate, measures air flow by measuring the resistance difference between the two heating bodies, and effectively solves the problems of conventional flow sensors, i.e. high power consumption, heat conduction of substrates and long response time.

Description

Technical field [0001] The invention belongs to a MEMS device, and particularly relates to a miniature flow sensor for air flow measurement. technical background [0002] With the continuous development of MEMS technology, many miniature sensors made according to MEMS technology have appeared, including flow sensors, acceleration sensors, speed sensors, and pressure sensors. [0003] According to the principle, the flow sensor can be divided into thermal type and non-thermal type. Van Putten et al. reported the first flow sensor based on silicon micromachining technology in 1974. The working principle of this sensor is based on heat transfer. According to different temperature measurement methods, thermal microfluidic sensors can be divided into two types: anemometer and calorimeter. The thermal micro flow sensor has many advantages, such as CMOS process compatibility, simple measurement, and easy process control. The main advantage is that the thermal micro flow sensor can easil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01F1/688B81B3/00
Inventor 汪学方刘胜胡畅王宇哲徐明海徐春林
Owner HUAZHONG UNIV OF SCI & TECH
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