Machining method of blind hole PCB (Printed Circuit Board)

Abstract

The invention discloses a machining method of a blind hole PCB (Printed Circuit Board), which comprises the steps of: S1, plating a corrosion-resisting layer on the board surface where a conductive layer needs to be thinned of a core board; S2, by adopting a lamination production process, manufacturing a blind hole on the core board to obtain the blind hole PCB; S3, by adopting an alkali etching process, etching the conductive layer overlapped on the corrosion-resisting layer in the lamination process; and S4, fading the corrosion-resisting layer. The embodiment of the invention ensures that the thinned conductive layer is distributed uniformly while the conducive layer laminated on the surface of the blind hole PCB is thinned so that multiple blind hole boards with minimum line width or spacing of outer layers are possibly produced by adopting the lamination process.

Description

technical field [0001] The invention relates to the technical field of printed circuit board (PCB) manufacturing technology, in particular to a method for processing a blind hole PCB board. Background technique [0002] In the process of producing blind hole PCB boards by lamination method, it is necessary to perform multiple copper plating treatments on the blind holes to ensure the conduction of the blind holes. However, when copper-plating blind holes, the surface of the PCB board will also be plated with copper at the same time, resulting in too thick copper layer on the PCB surface, which is not conducive to the production of outer-layer circuits. Therefore, it is necessary to thin the surface copper layer. . At present, sulfuric acid, hydrogen peroxide, sodium persulfate, etchant and other chemical corrosion solutions are mainly used to directly chemically corrode the copper layer on the surface of the blind hole PCB to thin the surface copper layer. [0003] The pro...

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Problems solved by technology

[0003] The production of blind hole PCB boards by lamination method requires multiple copper electroplating. Electrolytic copper plating will have the problem of uneven thickness of copper layer, and the use of chemical corrosion to reduce copper also has the problem of uneven copper thickness. The superposition of the two often leads to the problem of copper reduction The copper layer after copper is extremely uneven

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