Power distribution network in high-speed circuit system

Abstract

The invention discloses a power distribution network in a high-speed circuit system. The metal surface at one side of a buried capacitor is locally etched with a complementary split ring resonator, and the metal surface at the other side of the buried capacitor keeps complete; and simultaneously, the upper side and the lower side of the buried capacitor are respectively added with a layer of FR-4 medium, and SMA (shape memory alloy) coaxial joints are used for connecting a circuit board to a vector network analyzer to test a noise suppression transmission coefficient among ports. According to the power distribution network, the problems that the noise suppression band of a synchronous switch in the high-speed circuit system is not wide and the suppression degree is not deep are effectively solved, and simultaneously the damage for a return current path of a circuit is less. The mixed high-speed circuit system based on the power distribution network has good power integrity, and is convenient for standard technical processing of printed circuit boards.

Description

technical field [0001] The present invention relates to a power distribution network in a high-speed circuit system, in particular to a high-speed digital circuit and radio frequency / analog circuit system, which solves the problems of signal integrity and power integrity, and suppresses synchronous switching noise with a wide stop band. Power distribution network. Background technique [0002] With the development of electronic systems towards high speed, high power consumption, high density, low voltage and high current, in future hybrid circuit systems, high-speed digital processors, memories, radio frequency (RF) / analog circuits, sensors, Integration of multi-functional devices such as micro-electro-mechanical systems (MEMS), optoelectronic devices, etc. This kind of micro-system integration also requires communication and computing capabilities. System-in-package (SOP) technology provides the most effective solution for package-chip co-design and has become one of the t...

AI Technical Summary

Problems solved by technology

For example, in the method of adding a decoupling capacitor, the parasitic inductance will increase the high-frequency impedance of the capacitor, making the noise suppression measure invalid when the operating frequency is greater than GHz

While the power / ground plane split approach suppresses noise, it creates a discontinuity in the return current path, which destroys the signal integrity of high-speed circuits.

In addition, the method of selecting the position of the via hole through the resonance phenomenon can avoid the resonance peak of the resonance frequency, but the plane resonance also has frequency dependence, so that this method can only be used for certain specific resonance frequency points. has certain limitations

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