Copper surface gradient wetting self-assembly film and preparation method thereof

A gradient wetting, self-assembled film technology, which is applied to devices for coating liquid on surfaces, special surfaces, coatings, etc., can solve the problems of complicated preparation process and expensive raw materials, and achieve simple process flow and easy-to-obtain raw materials. , the effect of low price

Inactive Publication Date: 2012-07-04
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above methods all need to plate a layer of gold and silver precious metals on the substrate, which has the disadvantages of expensive raw materials and complicated preparation processes.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Continuously ultrasonically clean the copper sheet in hydrochloric acid, acetone, ethanol, and deionized water with a molar concentration of 2mol / L for 5 minutes, then use the pretreated copper sheet as the anode, and the graphite electrode as the cathode, 0.5mol / L Potassium hydroxide solution is used as the electrolyte, the current intensity is 400mA, and the electrodeposition time is 10min, until a layer of blue Cu(OH) is deposited on the surface of the copper sheet. 2 Precursor;

[0025] (2) The copper sheet after the electrodeposition in step (1) is placed in a high temperature dehydration at 150° C. for 3.5 hours and then taken out, and a layer of black CuO is formed on the surface of the copper sheet;

[0026] (3) Adopt the self-assembly method, place the copper sheet obtained in the step (2) in the beaker, gradually add dropwise the capric acid ethanol solution with a concentration of 0.05mmol / L, and the dropping time is 10min. After rinsing with water and e...

Embodiment 2

[0029] (1) Continuously ultrasonically clean the copper sheet in hydrochloric acid, acetone, ethanol, and deionized water with a molar concentration of 2mol / L for 5 minutes, then use the pretreated copper sheet as the anode and the platinum electrode as the cathode, 1.0mol / L Potassium hydroxide solution is used as the electrolyte, the current intensity is 200mA, and the electrodeposition time is 10min, until a layer of blue Cu(OH) is deposited on the surface of the copper sheet. 2 Precursor;

[0030] (2) The copper sheet after the electrodeposition in step (1) is placed in a high temperature dehydration at 160° C. for 3.5 hours and then taken out, and a layer of black CuO is formed on the surface of the copper sheet;

[0031] (3) Adopt the self-assembly method, place the copper sheet obtained in the step (2) in the beaker, gradually add dropwise the lauric acid ethanol solution with a concentration of 0.1mmol / L, the dropping time is 10min, after the dropping, use After rinsin...

Embodiment 3

[0034] (1) Continuously ultrasonically clean the copper sheet in hydrochloric acid, acetone, ethanol, and deionized water with a molar concentration of 2mol / L for 5 minutes, then use the pretreated copper sheet as the anode and the platinum electrode as the cathode, 2.0mol / L The sodium hydroxide solution is used as the electrolyte, the current intensity is 200mA, and the electrodeposition time is 7min, until a layer of blue Cu(OH) is deposited on the surface of the copper sheet. 2 Precursor;

[0035] (2) The copper sheet after the electrodeposition in step (1) was placed in a high temperature dehydration at 170° C. for 3 hours and then taken out, and a layer of black CuO was formed on the surface of the copper sheet;

[0036] (3) Adopt the self-assembly method, place the copper sheet obtained in step (2) in the beaker, gradually add dropwise the myristic acid ethanol solution with a concentration of 0.1mmol / L, the dropping time is 10min, and use After rinsing with absolute et...

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PUM

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Abstract

The invention discloses a preparation method of a copper surface gradient wetting self-assembly film. The method comprises the steps of (1), depositing a layer of Cu(OH)2 precursor on the surface of copper through electrochemical deposition, (2), generating a layer of black CuO on the surface of sheet copper subjected to electrodeposition and high-temperature dehydration, and (3) adopting self-assembly method to gradually drip fatty acid ethanol solution with the concentration being 0.05mmol/L to 0.5mmol/L to the sheet copper obtained at step (2), and then flushing the sheet copper with absolute ethyl alcohol after 1 to 10min dripping, so as to obtain the copper surface gradient wetting self-assembly film after air drying at room temperature. Compared with the traditional method of plating noble metal of gold and silver on a substrate, the method has the advantages that simple electrochemical plating is only required to be performed on the substrate and then a required substrate for self-assembly can be obtained after dehydration treatment; and the electrochemical deposition has the advantages that the cost of raw material is low, the raw material can be reused, arrays of prepared CuO are uniform and stable, the technological process is simple, the preparation time is short, and the like.

Description

technical field [0001] The invention relates to a gradient wetting self-assembly film and a preparation method thereof, in particular to a gradient wetting self-assembly film on a copper surface and a preparation method thereof. Background technique [0002] Gradient wettability material is a material whose surface physical and chemical properties change continuously along the direction parallel to the surface through the continuous change of surface topography and surface chemical composition. Generally, according to the nature of the gradient property change, it can be divided into two types: chemical composition gradient surface and microstructure gradient surface. In recent years, surface wettability gradient materials have been widely used in the fields of biocompatibility, diagnostics, nanotribology, microfluidics, liquid self-transport, etc., especially in promoting liquid droplet and microfluidic migration (flow) and strengthening There are important applications in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D5/00
Inventor 程江黄子恒皮丕辉文秀芳徐守萍杨卓如
Owner SOUTH CHINA UNIV OF TECH
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