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Cooling baffle device in vacuum coating equipment

A technology of vacuum coating and baffle device, which is applied in gaseous chemical plating, metal material coating process, coating, etc.

Inactive Publication Date: 2012-07-11
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned method of increasing the distance between the substrate and the anode only reduces the thickness of the film of non-diamond components, which slightly reduces the impact on the preparation of high-quality thin films. However, when growing high-quality, high-purity diamond films, cubic boron nitride films, nitrogen Other superhard coatings such as carbonized coatings will still have very adverse effects

Method used

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  • Cooling baffle device in vacuum coating equipment
  • Cooling baffle device in vacuum coating equipment
  • Cooling baffle device in vacuum coating equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Embodiment 2, Fig. 3, the schematic diagram of its baffle plate design of P jet CVD equipment and reaction chamber, in this method deposition superhard film, first start up, press support table 4 lifting button, adjust substrate 3 to plasma torch 15 lower anodes The distance between the nozzles is about 40mm, turn on the magnetic field, adjust the main current to the required range of process parameters, turn on the mechanical pump, and pre-pump the system vacuum. When the system vacuum pressure is below 1000Pa, turn on the refrigeration unit and the pump in turn; Move the baffle to the position where the base 3 is completely covered; close the exhaust valve of the gas distribution cabinet, fill the system with argon gas, pump the pressure to about 10KPa, open the valve of the gas distribution cabinet, connect the main power supply, open the hydrogen valve control, and immediately Press the arc ignition button to ignite the arc. At this time, the metal impurities near th...

Embodiment 2

[0024] The above description is a preferred embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be regarded as protection scope of the present invention.

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Abstract

The invention discloses a cooling baffle device in vacuum coating equipment. The cooling baffle device comprises a bottom plate and is characterized in that the cooling baffle device further comprises a baffle cavity and a baffle link communicated with the baffle cavity, wherein the baffle link and the baffle cavity are internally provided with cooling cycle devices; and a body of the baffle link is arranged on the bottom plate in a moving seal manner. Since the device prevents non-superhard films from being deposited on a substrate at the early stage of preparation, the nucleation density of superhard films and adhesion of film bases are increased, the internal stress of prepared superhard films is decreased, and the mechanical properties of the device are improved.

Description

technical field [0001] The invention relates to a cooling baffle device, in particular to a cooling baffle device used in vacuum coating equipment. Background technique [0002] In the deposition methods of diamond film and other superhard films (cubic boron nitride, carbon nitride, etc.), hot wire chemical vapor deposition (HFCVD) and plasma jet chemical vapor deposition (P jet CVD) are chemical vapor deposition methods. Several important deposition methods in the method (CVD). In the above two methods of depositing superhard films, some metal impurities and groups containing graphite carbon bonds are deposited on the surface of the substrate to form a non-diamond film, which will reduce the nucleation density of diamond films or other superhard films , a layer of non-superhard film or a film containing other electrode material impurities will grow on the surface of the substrate, which will reduce the bonding force of the film base, the purity of the film, and adversely a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/44
Inventor 李文帅相炳坤朱其豹庆振华
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS