Moisture/ultraviolet double-curing organic silicon adhesive

Abstract

The invention discloses design preparation of a double-curing organic silicon adhesive. The adhesive comprises the following components in parts by weight: 100-160 parts of polypropylene acyloxy alkoxy organic silicone, 0-150 parts of a silane coupling agent containing a structure, 0-50 parts of a filler, 0.1-5 parts of a catalyst, 1-5 parts of a photoinitiator, 0.1-1 part of an accelerator and 0.1-1 part of a polymerization inhibitor. The double-curing organic silicon adhesive has superior temperature resistance, and can be used at the temperature of between 60 DEG C below zero and 350 DEG C for a long time. The adhesive can be subjected to separate moisture curing or ultraviolet curing, and has higher bonding strength, hardness and the like after ultraviolet radiation; and after ultraviolet light is removed, moisture curing can be performed continually, so that the bonding strength of the adhesive is further improved, and a larger deeper depth is achieved. In an application field where ultraviolet light irradiation is unavailable and high bonding strength is required after curing, the double-curing performance of the adhesive can meet the application requirements of the field.

Description

technical field [0001] The invention relates to the design and preparation of a dual-curing silicone adhesive, in particular to a dual-curing functional adhesive that can be cured by both ultraviolet light and moisture and has high bonding strength after curing. Background technique [0002] Silicone resin (also known as polysiloxane) is a general term for a class of polymers that are composed of silicon atoms and oxygen atoms alternately connected to form a skeleton, and different organic groups are connected to silicon atoms. The structure of silicone resin contains both "organic group" and "inorganic structure". This special composition and molecular structure make it integrate the characteristics of organic matter and the function of inorganic matter. It can not only resist high temperature, but also resist low temperature. Therefore, it can be used in a wide temperature range, with good weather resistance, corrosion resistance, electrical insulation, ozone resistance, h...

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Problems solved by technology

Or in some application fields, for fields where ultraviolet light is not irradiated and high bonding strength is required after curing, it is difficult to achieve complete curing with a simple light curing system.

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