Zirconium-containing copper silver titanium solder alloy

A technology of titanium brazing filler metal and brass alloy, which is applied in the fields of copper-silver alloys and copper-silver-titanium brazing filler metals containing zirconium

Inactive Publication Date: 2012-10-03
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing literature shows that there is no report at home and abroad that adding zirconium to the silver-copper-titanium alloy to reduce the content of Ag and the side effects of Ti and improve the comprehensive performance of the alloy

Method used

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  • Zirconium-containing copper silver titanium solder alloy
  • Zirconium-containing copper silver titanium solder alloy
  • Zirconium-containing copper silver titanium solder alloy

Examples

Experimental program
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[0031] In the embodiment of the present invention, different contents of zirconium are added to the ingredients of copper-silver-titanium alloy (Ag: 10~45%, Ti: 1~4%, the balance is Cu), and its composition is different from the existing Ag71Cu27.5Ti1 .5 and other cast copper-silver-titanium alloys, the alloy ingredients of Examples 1, 2, 3, 4, 5 and comparative examples are shown in Table 1. The alloys of Examples and Comparative Examples were prepared by vacuum melting and casting into round billets under the protection of argon. The vacuum melting temperature is 1200~1500℃, and the vacuum degree is 0.001~0.1 Pa; the specific instructions are as follows:

Embodiment 1

[0035] Alloy ingredients (raw materials: pure silver, electrolytic copper, sponge titanium, Cu-50Zr master alloy) are melted in a vacuum induction melting furnace, and cast into ingots under argon protection. The melting point of the solder alloy is 781°C, and the Vickers hardness is 178HV. The solder alloy is used in the connection of brass alloy materials. The shear strength test shows that the shear strength of the solder joint is 81MPa, the solder and the solder material are well wetted, and there is no Cu on the interface between the solder and the solder material. 3 Ti phase is enriched.

Embodiment 2

[0037] Alloy ingredients (raw materials: pure silver, electrolytic copper, sponge titanium Cu-50Zr master alloy) are melted in a vacuum induction melting furnace, and cast into ingots under argon protection. figure 2 . The melting point of the solder alloy is 786°C, and the Vickers hardness is 198HV. The solder alloy is used in the connection of brass alloy materials. The shear strength test shows that the shear strength of the solder joint is 96MPa, the solder and the solder material are well wetted, and there is no Cu on the interface between the solder and the solder material. 3 Ti phase is enriched.

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Abstract

The invention discloses a zirconium-containing copper silver titanium solder alloy. The zirconium-containing copper silver titanium solder alloy comprises the following components by mass percent: 10-45% of Ag, 1-4% of Ti, 0.5-5% of Zr and Cu for the rest. A vacuum melting and argon shield casting mode is adopted, silver and copper are molten at first and then titanium and zirconium are added. The zirconium-containing copper silver titanium solder alloy can be used for directly soldering copper alloys, iron steel, ceramics and diamonds. The zirconium-containing copper silver titanium solder alloy has the advantages as follows: the cost is low; a connector is high in mechanical strength, has smooth surface, is stable in quality and is good in uniformity after the copper alloys are soldered by the zirconium-containing copper silver titanium solder alloy; and the joint clearances can be fully filled up. The zirconium-containing copper silver titanium solder alloy can replace the conventional copper silver titanium solder and is suitable for large-scale industrial application.

Description

technical field [0001] The invention relates to a copper-silver alloy, in particular to a zirconium-containing copper-silver-titanium solder alloy, which belongs to the technical field of medium-temperature solder materials. Background technique [0002] Ceramic materials have the characteristics of wear resistance, corrosion resistance, high temperature resistance, and good insulation, and are widely used in modern industry and technology fields, showing broad application prospects. However, due to the high hardness and poor plasticity of ceramic materials, it is difficult to deform and cut. Therefore, in engineering applications, quite a few are composite components composed of ceramics and metals or ceramics and ceramics. For this reason, the problem of connecting ceramics to metals and ceramics to ceramics must be solved. Previous studies have shown that active brazing is the most potential and widely used welding of ceramics and metals or ceramics and ceramics. At pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
Inventor 肖代红李秀秀申婷婷张福勤袁铁锤
Owner CENT SOUTH UNIV
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