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Electroplating process of probe for electric connector

A technology for electrical connectors and electroplating technology, which is applied in the field of electroplating technology for probes used in electrical connectors. It can solve the problems of increased production costs, complex processing of tin-gold-copper substrates, and many processing procedures, so as to achieve stable electrical signal transmission and improve resistance. Corrosion ability, effect of reducing production cost

Active Publication Date: 2012-10-03
DONGGUAN C C P CONTACT PROBES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this prior art has the following defects: 1. It is necessary to add a pre-plated silver layer to improve the wear resistance and corrosion resistance of the terminal, the cost of raw materials is high, and the processing procedures are many, which increases the production cost; 2. Pre-plated silver and The silver layer formed after silver plating and electroplating is easily oxidized, and the metal oxide film formed has no conductivity, resulting in a decrease in the conductivity of the terminal; 3. Lack of post-processing technology, the corrosion resistance and conductivity of the terminal surface are poor, and the overall performance of the product Poor; 4. The multiple electroplating of the prior art is only aimed at the electroplating of the contact area, and cannot form an overall electroplating layer on the surface of the terminal. Different coatings will display different colors, resulting in poor overall appearance quality of the terminal product
This prior art has the following defects: 1. It is only aimed at the electroplating process of the electrical connector housing, which is used to improve the corrosion resistance and salt spray resistance of the housing; 2. It is only suitable for products with tin-gold copper as the processing substrate , tin-gold copper is bronze containing 3% to 14% tin. In addition, alloy substrates made of elements such as phosphorus, zinc, and lead are often added. The processing of the tin-gold-copper substrate is complicated and the cost of raw materials is high; 3. Only contact Electroplating on the outer surface of the face, the conductivity of the product is poor
However, this reference document is aimed at the electroplating method of terminals with special structures. The electroplating process is complicated and cannot be applied to the electroplating of most terminals. In addition, it has strict requirements on the electroplating thickness of the terminal electroplating layer and high processing accuracy requirements. High difficulty

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] An electroplating process for probes used in electrical connectors, comprising the following processing steps: Step A, pretreatment; A1, ultrasonically oscillating the probes with 5% acid dehydration for 20 minutes; A2, cleaning the probes with pure water Needle; A3, carry out water rejection treatment with dehydrator, the gauze mesh number of dehydrator is 100 orders; A4, replace acid dehydration, repeat the operation of above-mentioned steps A1, A2 and A3; A5, under 40 ℃ of temperature, use The degreasing solution with a concentration of 80g / L was ultrasonically oscillated for 10 minutes, and the operations of steps A2 and A3 above were repeated.

[0077] Step B, activation treatment: Use 50g / L organic weak acid to ultrasonically oscillate the probe for 10 minutes; wash the probe with pure water; use 20% sulfuric acid to ultrasonically oscillate for 10 minutes; wash the probe with pure water .

[0078] Step C, electroplating copper film coating; electroplating copper...

Embodiment 2

[0083] An electroplating process for a probe for an electrical connector, comprising the following processing steps: Step A, pretreatment; A1, ultrasonically oscillating the probe with 10% acid dehydration, and processing for 15 minutes; A2, cleaning the probe with pure water Needle; A3, carry out water rejection treatment with dehydrator, the gauze mesh number of dehydrator is 120 orders; A4, replace acid dehydration, repeat the operation of above-mentioned steps A1, A2 and A3; A5, under 50 ℃ of temperature, use The degreasing solution with a concentration of 65g / L was ultrasonically oscillated for 15 minutes, and the operations of steps A2 and A3 above were repeated.

[0084] Step B, activation treatment: Use 30g / L organic weak acid to ultrasonically oscillate the probe for 15 minutes; wash the probe with pure water; use 15% sulfuric acid to perform ultrasonic oscillation for 15 minutes; wash the probe with pure water .

[0085] Step C, electroplating copper film coating; e...

Embodiment 3

[0090] An electroplating process for probes for electrical connectors, comprising the following processing steps: step A, pretreatment; A1, ultrasonically oscillating the probes with 15% acid dehydration, and processing for 10; A2, cleaning the probes with pure water Needle; A3, carry out water rejection treatment with dehydrator, the gauze mesh number of dehydrator is 150 orders; A4, replace acid dehydration, repeat the operation of above-mentioned steps A1, A2 and A3; A5, under 60 ℃ temperature, use The degreasing solution with a concentration of 50g / L was ultrasonically oscillated for 20 minutes, and the operations of steps A2 and A3 above were repeated.

[0091] Step B, activation treatment: Use 10g / L organic weak acid to ultrasonically oscillate the probe for 20 minutes; wash the probe with pure water; use 10% sulfuric acid to perform ultrasonic oscillation for 20 minutes; wash the probe with pure water .

[0092] Step C, electroplating copper film coating; electroplatin...

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PUM

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Abstract

The invention relates to the field of electroplating technology, in particular to an electroplating process of a probe for an electric connector. The electroplating process comprises the following fabrication steps: A. conducting pre-processing on the probe so as to remove oil stain; B. conducting activating processing on the probe, and coating an oxidation film on the surface of the activated probe; C. plating a copper film plating layer on the surface of the probe; D. plating a gold film plating layer on the surface of the copper film plating layer; E. plating a ruthenium film plating layer on the surface of the gold film plating layer; and F. conducting post-processing on the surface of the ruthenium film plating layer, and carrying out surface hole sealing, rinsing and drying. The electroplating process is low in raw material cost, low in fabrication difficulty and low in production cost, and can meet the high requirement on appearance quality of the electric connector product.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating process for a probe used in an electrical connector. Background technique [0002] With the development of technology, consumers are constantly pursuing the direction of thinner and lighter electronic products, and pogo pinconnectors have gradually become the primary and basic considerations for product structure designers. At present, probe connectors have been successfully applied to the following fields: mobile phones, military communications, aerospace electronics, medical equipment, portable consumer electronics, etc. Probes, as one of the main components of electrical connectors, are rapidly developing Replacing the shrapnel used in traditional connectors has gradually become the mainstream of technology. [0003] At present, in order to improve the electrical conductivity of the probes for electrical connectors and prevent the deterioration of the...

Claims

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Application Information

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IPC IPC(8): C25D5/10C25D7/00
Inventor 林璟宇
Owner DONGGUAN C C P CONTACT PROBES
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