A ceramic aluminum-clad substrate and its preparation method

A ceramic substrate and aluminum-coated technology, which is applied in the field of ceramic metallization, can solve the problems of secondary processing, cost consumption, process control, and high equipment requirements, and achieve the effect of cost saving

Active Publication Date: 2015-12-02
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention aims to solve the technical problems that the existing preparation method of the ceramic aluminum-clad substrate has high requirements on process control and equipment, and requires secondary processing after demoulding, which is costly

Method used

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preparation example Construction

[0020] The present invention also provides a method for preparing a ceramic aluminum-clad substrate, comprising the following steps:

[0021] Step 1, pretreatment: pretreatment is performed on the ceramic substrate.

[0022] The ceramic substrate used in the present invention can be a ceramic substrate commonly used in the art, preferably an aluminum nitride ceramic substrate, an alumina ceramic substrate, which can be obtained commercially, for example: Fujian Huaqing Electronic Material Technology Co., Ltd. AlN ceramic substrates. The thickness of the ceramic substrate is not particularly limited, and it is generally available on the market, but in order to save costs, preferably, the thickness of the ceramic substrate is 0.1-1mm, more preferably 0.38-0.63mm .

[0023] The pretreatment includes cleaning the ceramic substrate, and then roughening or sandblasting. The cleaning includes sequentially degreasing, water washing, pickling, and water washing and then drying the c...

Embodiment 1

[0044] 1. Pretreatment: Take a 0.6mm thick alumina ceramic substrate, use JPL-209 universal degreasing agent produced by Shenzhen Jabil Electronic Technology Co., Ltd. to degrease the alumina ceramic substrate for 2 minutes, then wash it with water, and then use H 2 SO 4 Solution (H 2 SO 4 The content is 5wt%) pickling for 3 minutes, washing with water, drying, and then sandblasting;

[0045] 2. Aluminum-coated film: After sandblasting, a layer of aluminum film with a thickness of 1 μm is coated on one surface of the ceramic substrate by vacuum magnetron sputtering. ﹣3 It is carried out under the vacuum degree of Pa, the target material is aluminum target material, the sputtering time is 5min, the voltage is 370V, and the current is 12A;

[0046] 3. Applying aluminum foil: Lay 0.08mm thick 4047 aluminum silicon solder sheet and 0.4mm thick aluminum foil on the aluminum film in sequence, and apply an iron block on the aluminum foil so that the uniform pressure on the surface...

Embodiment 2

[0048] 1. Pretreatment: Take a 0.5mm thick alumina ceramic substrate, use JPL-209 universal degreasing agent produced by Shenzhen Jabil Electronic Technology Co., Ltd. to degrease the alumina ceramic substrate for 3 minutes, wash it with water, and then use H 2 SO 4 Solution (H 2 SO 4 The content is 6wt%) after pickling for 4 minutes, water washing, drying, and then sandblasting;

[0049] 2. Aluminum-coated film: After sandblasting, a layer of aluminum film with a thickness of 2 μm is coated on one surface of the ceramic substrate by vacuum magnetron sputtering. ﹣3 It is carried out under the vacuum degree of Pa, the target material is aluminum target material, the sputtering time is 10min, the voltage is 400V, and the current is 12A;

[0050] 3. Applying aluminum foil: Lay 0.1mm thick 4047 Al-Si solder sheet and 0.5mm thick aluminum foil on the aluminum film in sequence, and apply an iron block on the aluminum foil so that the uniform pressure on the surface of the aluminu...

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Abstract

The invention provides a manufacturing method for a ceramic aluminum-coated base plate. The manufacturing method comprises the following steps: coating an aluminum membrane, namely, coating a layer of aluminum membrane on at least one surface of ceramic wafers by a physical vapor deposition method; and connecting aluminum foils in a compressing way, namely, stacking aluminum base brazing filler metal sheets and the aluminum foils on the aluminum membranes in sequence, and sintering to obtain the ceramic aluminum-coated base plate. The invention further provides the ceramic aluminum-coated base plate manufactured by the manufacturing method. The ceramic aluminum-coated base plate comprises the ceramic wafers and the aluminum foils arranged on the at least one surface of the ceramic wafers, and aluminum membrane layers and aluminum base brazing filler metal layers are formed between the ceramic wafers and the aluminum foils in sequence. The manufactured ceramic aluminum-coated base plate is good in bonding force, strong in cold and hot impact resistance, and simple in manufacturing process, does not need secondary processing and is low in cost.

Description

technical field [0001] The invention relates to the field of ceramic metallization, and more specifically relates to a ceramic aluminum-clad substrate and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics technology, electronic devices tend to be high-power, high-density, and multi-functional, and the integration of electronic circuits is getting higher and higher, which inevitably generates a lot of heat when the circuit is working. In order to prevent electronic components from being damaged due to heat accumulation, ceramic materials with a thermal expansion coefficient matching semiconductor Si, high thermal stability, chemical stability and low dielectric constant have become the most widely used electronic substrate materials in the industry. [0003] Those skilled in the art know that if ceramic materials need to be applied to circuits, they must first be metallized, that is, a layer of metal that is firmly bond...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B18/00B32B15/04B32B15/20B32B37/06C23C14/18C23C14/35
Inventor 徐强任永鹏张保祥林信平
Owner BYD CO LTD
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