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Polyurethane acrylic ester photosensitive resin oligomer and preparation method thereof

A polyurethane acrylate and photosensitive resin technology, applied in the material field, can solve the problems of easy yellowing and insufficient flexibility, and achieve the effects of solving yellowing, high resolution and high glass transition temperature.

Active Publication Date: 2012-11-14
恒昌涂料(惠阳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its shortcomings: lack of softness, brittleness, easy yellowing at high temperature

Method used

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  • Polyurethane acrylic ester photosensitive resin oligomer and preparation method thereof
  • Polyurethane acrylic ester photosensitive resin oligomer and preparation method thereof
  • Polyurethane acrylic ester photosensitive resin oligomer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Add 312g of 3-methylene carbamic acid propionate-3,5,5-trimethylcyclohexyl isocyanate to 370g of tris(epoxypropyl)isocyanuric acid acrylate, with toluene as solvent, at 85°C The reaction was stirred for 5 hours. After the reaction was completed, the solvent was removed from the reaction mixture by vacuum distillation to obtain the final product, namely a urethane acrylate structure containing at least one carboxyl group and one triazine ring in one molecule.

Embodiment 2

[0024] Add 340g of 3-methylenecarbamic acid valerate-3,5,5-trimethylcyclohexyl isocyanate into 383g of three (epoxypropyl)isocyanuric acid methacrylate, with xylene as solvent, The reaction was stirred at 85°C for 5 hours. After the reaction was completed, the solvent was removed from the reaction mixture by vacuum distillation to obtain the final product, namely a urethane acrylate structure containing at least one carboxyl group and one triazine ring in one molecule.

Embodiment 3

[0026] 354g 3-methylene carbamic acid hexanoate-3,5,5-trimethylcyclohexyl isocyanate is added among 383g tris (epoxypropyl) isocyanuric acid methacrylate, with toluene as solvent, in The reaction was stirred at 85°C for 5 hours. After the reaction was completed, the solvent was removed from the reaction mixture by vacuum distillation to obtain the final product, namely a urethane acrylate structure containing at least one carboxyl group and one triazine ring in one molecule.

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Abstract

The invention belongs to the technical field of materials and particularly relates to a polyurethane acrylic ester photosensitive resin oligomer for light-emitting diode (LED) light-sensation solder-proof printing ink. The oligomer is of a polyurethane acrylic ester structure, an oligomer molecule comprises at least one carboxyl and one triazine heterocycle. A preparation method of the polyurethane acrylic ester photosensitive resin oligomer comprises enabling a polyurethane compound containing at least one carboxyl and at least one NCO group and an acrylic ester compound containing at least two carboxyls and at least one triazine ring structure to be dissolved through a solvent, heating and stirring, removing the solvent after the reaction is finished, and obtaining the final product. Besides fundamental performances of ordinary solder-proof printing ink, the LED light-sensation solder-proof printing ink prepared through the oligomer further has unique high whiteness and high reflection and strengthened performances of resisting chemical gold and heat, and development can be achieved through alkaline solution.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to a polyurethane acrylate photosensitive resin oligomer used for LED photosensitive solder resist ink, and also relates to a preparation method of the oligomer. Background technique [0002] In recent years, LED has received extensive attention and developed rapidly because of its high brightness, low operating voltage, low power consumption, large size, long life, impact resistance and stable performance. In order for LEDs to achieve high brightness, it is required that the photosensitive solder resist ink on the side of the LED pins welded in the aluminum substrate for LEDs is ultra-white and has a high reflective effect. [0003] The process of using LED photosensitive solder resist ink is: printing --- 75 ℃ low temperature pre-baking --- film exposure --- sodium carbonate solution development --- 150 ℃ baking for 1 hour --- gold, tin (temperature 288°C) or OSP anti-oxidation -...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D251/32C09D11/02C09D11/101C09D11/102
Inventor 彭忠杨爱军
Owner 恒昌涂料(惠阳)有限公司
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