Polymeric thin-film material ozone treatment graft modification chemical copper plating method

A technology of polymer film and electroless copper plating, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems that are not suitable for double-sided panel production, slow reaction of gas-phase photografting, etc., and achieve high bonding strength Improvement, fast copper plating rate, simple operation

Active Publication Date: 2012-11-14
HUIZHOU KING BROTHER CIRCUIT TECH +1
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Problems solved by technology

The advantage of this patent is that photografting can be used to obtain a higher grafting rate. The disadvantage is that the gas-phase photografting reaction is relatively slow, and a toxic acetone-loaded catalyst is used. Nitrogen protection gas must be introduced during

Method used

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[0018] In order to facilitate the understanding of those skilled in the art, the principle of the present invention will be further described in detail below in conjunction with specific embodiments.

[0019] The invention discloses a method for ozone treatment of a polymer film material to graft modified electroless copper plating, which comprises the following steps:

[0020] Including the following steps:

[0021] (1) Cleaning, put the polymer film in absolute ethanol CH 3 Ultrasonic cleaning in OH solution for 3~5min, dry for later use;

[0022] (2) Ozone treatment, put the polymer film in 5~15g / L sodium hydroxide NaOH solution, and pass ozone O 3 For treatment, rinse the treated film with tap water.

[0023] (3) Chemical grafting, put the processed polymer film on acrylamide CH2=CHCONH2, cerium ammonium nitrate Ce(NH 4 ) 2 (NO 3 ) 6 And ferrous ammonium sulfate Fe(NH 4 ) 2 (SO 4 ) 2 ·6H 2 In an aqueous solution of O, react at 40-60°C for 5-20min, take it out, ultrasonically clean i...

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Abstract

The invention discloses a polymeric thin-film material ozone treatment graft modification chemical copper plating method. The method comprises the steps of (1), washing; (2), performing ozone treatment; (3) performing chemical grafting and placing processed polymeric thin films into a water solution of acrylamide CH2=CHCONH2, ceric ammonium nitrate Fe(NH4)2(NO3)6 and ammonium ferrous sulfate Fe(NH4)2(SO4)2.6H2O; (4), performing activation and placing the grafted polymeric thin films into a solution of 0.1-1g/L of silver nitrate AgNO3 and 10-15mL/L37% of ammonia water BH3.H2O and immersing for 10-60s; and performing chemical copper plating, placing the activated thin films into chemical copper plating liquid and subjecting the thin films and the solution to reaction for 10-20min. The polymeric thin-film material ozone treatment graft modification chemical copper plating method has the advantages that the method is simple, practical, economical and environment-friendly, chemical copper plating can be performed on a polyethylene terephthalate (PET) thin film, the copper plating liquid is not required to be heated, and the method can be conducted at a normal temperature, and the like.

Description

technical field [0001] The invention relates to a polymer film surface treatment process, in particular to a method for grafting and modifying electroless copper plating of a polymer film material by ozone treatment. Background technique [0002] At present, the circuit board industry mainly uses the subtractive method to produce soft boards, that is, to adhere a layer of copper foil on the polyimide or polyethylene terephthalate substrate, and then corrode the unnecessary parts according to the circuit diagram. Lose. This method is a waste of copper resources, and the waste liquid is difficult to handle and pollutes the environment. So it is imminent to develop a method that can directly plate copper on PET film. [0003] So far, there is only one patent for direct electroless copper plating on PET film. The Chinese invention patent with application number 201110043365.9 and application date of February 23, 2011 discloses a palladium-free electroless copper plating on pol...

Claims

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Application Information

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IPC IPC(8): C23C18/20C23C18/38
Inventor 武守坤潘湛昌程果李柱梁胡光辉肖楚民邓剑锋何大钢
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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