Conductive particle, method for producing same, anisotropic conductive film, assembly and connection method

一种导电性粒子、各向异性的技术，应用在导电黏合剂连接、导电连接、分散在不导电无机材料中的导电材料等方向，能够解决连接可靠性降低、不能提高耐腐蚀性等问题

Active Publication Date: 2012-11-21
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, in this conductive particle, although the surface is modified, the corrosion resistance cannot be improved, so there is a problem that the connection reliability is lowered.

Method used

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  • Conductive particle, method for producing same, anisotropic conductive film, assembly and connection method
  • Conductive particle, method for producing same, anisotropic conductive film, assembly and connection method
  • Conductive particle, method for producing same, anisotropic conductive film, assembly and connection method

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1）

[0152]

[0153] Styrene resin particles with a number average particle diameter of 3.8 μm (manufactured by Sekisui Chemical Industry Co., Ltd., trade name: Micropar) were put into an aqueous solution of thallium nitrate, and stirred while heating to 60° C., at a rate of 30 mL / min. A mixed solution of nickel sulfate (manufactured by Aldrich), sodium hypophosphite (manufactured by Aldrich), sodium citrate (manufactured by Aldrich), and thallium nitrate (manufactured by Aldrich) adjusted to a predetermined pH with ammonia water or sulfuric acid was added at a high speed, In this way, nickel plating is performed. This plating solution was filtered, and the filtrate was washed with pure water, and then dried in a vacuum dryer at 80°C to prepare a nickel plating with a phosphorus concentration of 1.3% by mass and an average thickness of 101 nm on which a conductive layer was formed. layer of nickel-plated particles A.

[0154]

[0155] In addition, to measure the thickness of t...

manufacture example 2）

[0157]

[0158] Except that the mixing ratio of nickel sulfate, sodium hypophosphite, sodium citrate, and thallium nitrate in the mixed solution of Production Example 1 was changed, the phosphorus concentration in which the conductive layer was formed was 2.6% by mass, and the average Nickel particles B were plated on a nickel-plated layer having a thickness of about 101 nm.

manufacture example 3）

[0160]

[0161] Except that the mixing ratio of nickel sulfate, sodium hypophosphite, sodium citrate, and thallium nitrate in the mixed solution of Production Example 1 was changed, the phosphorus concentration in which the conductive layer was formed was 4.8% by mass, and the average Nickel-plated particles C of a nickel-plated layer having a thickness of about 102 nm.

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PUM

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Abstract

A conductive particle comprises a core particle and a conductive layer formed on the surface of the core particle. The core particle is formed from at least a resin or a metal. The surface of the conductive layer has a phosphorus-containing hydrophobic group.

Description

technical field [0001] The present invention relates to electroconductive particles, a method for producing the same, and an anisotropic conductive film using the electroconductive particles, a bonded body, and a connection method. Background technique [0002] Circuits such as the connection between a liquid crystal display and a tape carrier package (Tape Carrier Package: TCP), the connection between a flexible printed circuit (FPC) and a TCP, or the connection between an FPC and a printed wiring board (PWB) For connection between components, a circuit connection material (such as an anisotropic conductive film) in which conductive particles are dispersed in an adhesive resin is used. In addition, recently, in the case of mounting a semiconductor silicon chip on a substrate, in order to connect circuit components, instead of using wire bonding, the semiconductor silicon chip is directly mounted on the substrate face-down, and a so-called flip chip is performed. chip insta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00H01B5/16H01B13/00H01R11/01
CPCH01B1/22H01R13/03H01R4/04C09J9/02H01R11/01B22F1/16
Inventor 大关裕树石松朋之塚尾怜司
Owner DEXERIALS CORP
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