Storage Elements and Storage Devices
A technology of storage elements and storage layers, applied in the direction of electrical components, etc., can solve the problems of insufficient improvement of retention characteristics and repeated operation characteristics, and achieve the effect of improving repeated operation characteristics
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[0036] 1. Memory element: a memory element with a single-layer structure in which the variable resistance layer is
[0037] 2. Storage device
[0038] [Modification]
[0039] (The variable resistance layer is a memory element with a multilayer structure)
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[0041] [implementation mode]
[0042] [storage element]
[0043] figure 1 It is a cross-sectional view showing the structure of the memory element 1 according to the embodiment of the present invention. This memory element 1 is configured to include a memory layer 20 provided between a lower electrode 10 (first electrode) and an upper electrode 30 (second electrode).
[0044] For example, the lower electrode 10 is provided on the substrate 41, and the substrate 41 is provided with ( figure 2 ) CMOS (Complementary Metal Oxide Semiconductor) circuit, so that the lower electrode 10 serves as a connection portion with the CMOS circuit. This lower electrode 10 is made of the following wiring materials used in semiconductor processes, such as W (tungsten), WN (tungsten nitride), TiN (titanium nitride), Cu (copper), Al (aluminum), Mo ( Molybdenum), Ta (tantalum) and silicide. When the lower electrode 10 is made of a material such as copper that may cause ion conduction in an elec...
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