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Modified cyanate adhesive film and preparation method thereof
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A cyanate ester, high-strength technology, applied in the direction of adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve the problems of low mechanical properties, easy crystallization of cyanate film, etc., to achieve excellent mechanical properties, Reduced energy consumption and excellent dielectric properties
Active Publication Date: 2015-04-01
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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[0005] The present invention aims to solve the technical problems that the surface of the cyanate film prepared by the existing cyanate film preparation method at room temperature is easy to crystallize and has low mechanical properties, and provides a high-strength modified cyanate film Adhesive film and its preparation method
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specific Embodiment approach 1
[0016] Specific embodiment one: a kind of high-strength modified cyanate ester adhesive film provided in this embodiment, by weight parts by cyanate ester resin of 60~100 parts, epoxy resin of 5~40 parts, 1 part ~50 parts of toughening resin, 1~10 parts of reactive diluent and 1~5 parts of accelerator.
[0017] The modified cyanate film provided by this embodiment has crystallization on the surface when it is placed at room temperature for more than 20 days, and has excellent mechanical properties. The shear strength at room temperature can reach 35.6 MPa, and the peel strength can reach 78.9 N / cm; agent, to promote the curing reaction of cyanate ester, so that the dielectric properties of the modified cyanate ester film are excellent, and the dielectric constant at room temperature reaches 3.09.
specific Embodiment approach 2
[0018] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the cyanate resin is 4,4'-dicyanate diphenylmethane, 4,4'-dicyanate diphenylethane, 4,4'-dicyanatodiphenylpropane, 4,4'-dicyanatodiphenylbutane, 2,2-bis(4-cyanato -3,5-Dimethylphenyl)propane, 2,2-bis(4-cyanato-3-methylphenyl)propane, 2,2-bis(4-cyanato-3- tert-butylphenyl)propane, 2,2-bis(4-cyanato-3-methylphenyl)propane, 2,2-bis(4-cyanato-3-tert-butyl-6 -Methylphenyl)propane, 2,2-bis(4-cyanato-3-allylphenyl)propane, 1,1-bis(4-cyanato-3-tert-butyl- 6-methylphenyl)butane, 1,1-bis(4-cyanatophenyl)cyclohexane, 1,1-bis(4-cyanato-3-methylphenyl)cyclohexane One or a combination of hexane and 1,1-bis(4-cyanate-3-cyclohexyl-6-methyl)butane. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0019] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin and One or a combination of several phenolic epoxy resins; the toughening resin is vinyl resin, polyethersulfone, polysulfone, polyether ether ketone, polyphenylene ether, polyphenylene sulfide, poly One or a combination of imide resin, polyphenoloxygen resin and nylon, wherein the molecular weight of the vinyl resin is 300,000-500,000. Others are the same as in the first or second embodiment.
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Abstract
The invention relates to a modified cyanateadhesive film and a preparation method thereof, belonging to the field of modified cyanateadhesive films and preparation methods thereof. The invention aims at solving the technical problems that the surface of the cyanateadhesive film prepared by using the existing cyanate adhesive film preparation method is apt to be crystallized during placing at room temperature, the mechanical performance is low and the curing temperature is high. The modified cyanate adhesive film is prepared by using the following components in parts by weight: 60-100 parts of cyanate resin, 5-40 parts of epoxy resin, 1-50 parts of toughened resin, 1-10 parts of activated thinner and 1-5 parts of accelerator. The preparation method comprises the following steps of: 1) weighing raw materials; 2) preparing matrix resin; 3) preparing adhesive; and 4) preparing the modified cyanate adhesive film. The modified cyanate adhesive film and the preparation method thereof are used in the fields of aerospace and electronic information.
Description
technical field [0001] The invention relates to the field of cyanate film and its preparation method. Background technique [0002] In modern technology, cyanate resin has good heat resistance, dielectric properties, mechanical properties and process properties, etc. It belongs to high-performance resin matrix materials like epoxy resin and bismaleimide resin, and can be Applied to structural materials, wave-transmitting materials, adhesive materials, dielectric functional materials, etc., used in the aerospace field, electronic information field, etc. For example, there are higher requirements for materials used in the bonding of high-performance radomehoneycomb sandwich structures, the resistance of integrated circuit circuit boards and the manufacture of copper-clad circuit boards. [0003] In the field of aviation and aerospace, honeycomb sandwich structure is often used for bonding structural parts, and adhesive film is mostly used for bonding skin and honeycomb core....
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